Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804245 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang | 2020-10-13 |
| 10777467 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chien-Kuo Chang, Chih-Hao Lin, Jung-Tsung Cheng | 2020-09-15 |
| 10700031 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Yu-Min Liang | 2020-06-30 |
| 10685853 | Lid attach processes for semiconductor packages | Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Jason Shen | 2020-06-16 |
| 10658263 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang, Wen-Lin Chen | 2020-05-19 |
| 10622278 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang | 2020-04-14 |
| 10515941 | Methods of forming package-on-package structures | Yu-Chih Liu, Wei-Ting Lin, Chin-Liang Chen, Jing Ruei Lu | 2019-12-24 |
| 10468307 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chien-Kuo Chang, Chih-Hao Lin, Jung-Tsung Cheng | 2019-11-05 |
| 10276508 | Semiconductor packages and methods of forming the same | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang | 2019-04-30 |
| 10269679 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang | 2019-04-23 |
| 10269668 | System and method for bonding package lid | Shih-Yen Lin, Yu-Chih Liu, Chin-Liang Chen, Wei-Ting Lin | 2019-04-23 |
| 10163754 | Lid design for heat dissipation enhancement of die package | Sheng-Hsiang Chiu, Hsin-Yu Pan, Yu-Chih Liu, Chin-Liang Chen | 2018-12-25 |
| 10157772 | Semiconductor packaging structure and process | Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Shih-Yen Lin | 2018-12-18 |
| 10157863 | Method for forming a lid structure for a semiconductor device package | Chin-Liang Chen, Chi-Yang Yu, Yu-Chih Liu | 2018-12-18 |
| 10157871 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Yu-Min Liang | 2018-12-18 |
| 9941186 | Method for manufacturing semiconductor structure | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang | 2018-04-10 |
| 9893043 | Method of manufacturing a chip package | Chin-Liang Chen, Yu-Chih Liu, Wei-Ting Lin, Shih-Yen Lin | 2018-02-13 |
| 9865566 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang | 2018-01-09 |
| 9859265 | Package structure and methods of forming the same | Yu-Chih Liu, Wei-Ting Lin, Chin-Liang Chen, Jing Ruei Lu | 2018-01-02 |
| 9812410 | Lid structure for a semiconductor device package and method for forming the same | Chin-Liang Chen, Chi-Yang Yu, Yu-Chih Liu | 2017-11-07 |
| 9805997 | Packaging methods for semiconductor devices with encapsulant ring | Yu-Chih Liu, Chien-Kuo Chang, Wei-Ting Lin, Chin-Liang Chen, Shih-Yen Lin | 2017-10-31 |
| 9786520 | Semiconductor device and manufacturing method thereof | Yu-Chih Liu, Chang-Chia Huang, Shih-Yen Lin, Chin-Liang Chen, Wei-Ting Lin | 2017-10-10 |
| 9735043 | Semiconductor packaging structure and process | Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Shih-Yen Lin | 2017-08-15 |
| 9673119 | System and method for bonding package lid | Shih-Yen Lin, Yu-Chih Liu, Chin-Liang Chen, Wei-Ting Lin | 2017-06-06 |
| 9502373 | Lid attach process and apparatus for fabrication of semiconductor packages | Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Jason Shen | 2016-11-22 |