Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417536 | Automated detection system for acute ischemic stroke | Yong Chen, Wei Lin, Hsiang-Chun Yang, YU-LIN YEH, Evelyne Calista +1 more | 2025-09-16 |
| 12363981 | Semiconductor device and method for forming the same | Po-Cheng TSAI | 2025-07-15 |
| 12266602 | Integrated circuit structure and method for forming the same | Yu Zhang, Kuan-Chao CHEN, Si-Chen Lee, Chi-Tien Chen | 2025-04-01 |
| 12080557 | Method for forming 2-D material semiconductor device with improved source/drain electrodes and gate dielectric | Po-Cheng TSAI, Yu Zhang | 2024-09-03 |
| 11211460 | 2D crystal hetero-structures and manufacturing methods thereof | Si-Chen Lee, Samuel C. Pan, Kuan-Chao CHEN | 2021-12-28 |
| 11171212 | Semiconductor device and method of formation | Meng-Yu Lin, Si-Chen Lee | 2021-11-09 |
| 11152209 | Forming semiconductor structures with two-dimensional materials | Hsuan-An Chen, Si-Chen Lee | 2021-10-19 |
| 11121214 | Source/drain contact with 2-D material | Kuan-Chao CHEN, Hsuan-An Chen, Lun-Ming Lee | 2021-09-14 |
| 10985019 | Method of forming a semiconductor device using layered etching and repairing of damaged portions | Kuan-Chao CHEN, Si-Chen Lee, Samuel C. Pan | 2021-04-20 |
| 10879140 | System and method for bonding package lid | Yu-Chih Liu, Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho | 2020-12-29 |
| 10872973 | Semiconductor structures with two-dimensional materials | Hsuan-An Chen | 2020-12-22 |
| 10867835 | Semiconductor packaging structure and process | Kuan-Lin Ho, Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu | 2020-12-15 |
| 10784351 | 2D crystal hetero-structures and manufacturing methods thereof | Si-Chen Lee, Samuel C. Pan, Kuan-Chao CHEN | 2020-09-22 |
| 10636652 | Method of forming a semiconductor device using layered etching and repairing of damaged portions | Kuan-Chao CHEN, Si-Chen Lee, Samuel C. Pan | 2020-04-28 |
| 10541132 | Forming semiconductor structures with two-dimensional materials | Hsuan-An Chen, Si-Chen Lee | 2020-01-21 |
| 10505052 | Semiconductor device with transition metal dichalocogenide hetero-structure | Chi-Wen Liu, Chong-Rong Wu, Xiang-Rui Chang | 2019-12-10 |
| 10403744 | Semiconductor devices comprising 2D-materials and methods of manufacture thereof | Samuel C. Pan, Chong-Rong Wu, Xian-Rui Chang | 2019-09-03 |
| 10269902 | Semiconductor device and method of formation | Meng-Yu Lin, Si-Chen Lee | 2019-04-23 |
| 10269564 | Method of forming a semiconductor device using layered etching and repairing of damaged portions | Kuan-Chao CHEN, Si-Chen Lee, Samuel C. Pan | 2019-04-23 |
| 10269668 | System and method for bonding package lid | Yu-Chih Liu, Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho | 2019-04-23 |
| 10164122 | Semiconductor device with transition metal dichalocogenide hetero-structure | Chi-Wen Liu, Chong-Rong Wu, Xiang-Rui Chang | 2018-12-25 |
| 10157737 | Semiconductor devices comprising 2D-materials and methods of manufacture thereof | Meng-Yu Lin, Si-Chen Lee, Samuel C. Pan | 2018-12-18 |
| 10157772 | Semiconductor packaging structure and process | Kuan-Lin Ho, Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu | 2018-12-18 |
| 10147603 | Method of manufacturing a FET using a two dimensional transition metal dichalcogenide including a low power oxygen plasma treatment | Chi-Wen Liu, Si-Chen Lee, Chong-Rong Wu, Kuan-Chao CHEN | 2018-12-04 |
| 9899537 | Semiconductor device with transition metal dichalocogenide hetero-structure | Chi-Wen Liu, Chong-Rong Wu, Xian-Rui Chang | 2018-02-20 |