Issued Patents All Time
Showing 1–25 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417969 | Semiconductor structure and circuit structure | Kuan-Lin Ho, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang, Jiun Yi Wu | 2025-09-16 |
| 12417968 | Package structure and forming method thereof | Chi-Yang Yu, Yu-Min Liang, Hao-Cheng Hou, Jung Wei Cheng, Tsung-Ding Wang | 2025-09-16 |
| 12412846 | Semiconductor package and methods of fabricating a semiconductor package | Hao-Cheng Hou, Yu-Min Liang, Jung Wei Cheng, Tsung-Ding Wang | 2025-09-09 |
| 12347802 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang, Jiun Yi Wu | 2025-07-01 |
| 12165946 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen | 2024-12-10 |
| 12062604 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Jiun Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2024-08-13 |
| 12062619 | Semiconductor packages and forming methods thereof | Kai-Chiang Wu, Jiun Yi Wu, Yen-Ping Wang | 2024-08-13 |
| 11972956 | Lid attach process and dispenser head | Wei-Ting Lin, Yu-Chih Liu, Kuan-Lin Ho, Jason Shen | 2024-04-30 |
| 11908835 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang | 2024-02-20 |
| 11824032 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang, Jiun Yi Wu | 2023-11-21 |
| 11810847 | Package structure and method of fabricating the same | Kuan-Lin Ho, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang, Jiun Yi Wu | 2023-11-07 |
| 11784106 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen | 2023-10-10 |
| 11749594 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Jiun Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2023-09-05 |
| 11616037 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang | 2023-03-28 |
| 11594479 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang, Jiun Yi Wu | 2023-02-28 |
| 11508640 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen | 2022-11-22 |
| 11424220 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang | 2022-08-23 |
| 11417643 | Package-on-package with redistribution structure | Yu-Chih Liu, Kuan-Lin Ho, Wei-Ting Lin, Jing Ruei Lu | 2022-08-16 |
| 11387118 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Chi-Yang Yu, Jung Wei Cheng | 2022-07-12 |
| 11355461 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang | 2022-06-07 |
| 11348874 | Semiconductor packages and forming methods thereof | Kai-Chiang Wu, Jiun Yi Wu, Yen-Ping Wang | 2022-05-31 |
| 11315862 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Jiun Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2022-04-26 |
| 11264304 | Semiconductor structure and associated method for manufacturing the same | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang | 2022-03-01 |
| 10957672 | Package structure and method of manufacturing the same | Chi-Yang Yu, Chien-Hsun Lee, Kuan-Lin Ho, Yu-Min Liang | 2021-03-23 |
| 10879140 | System and method for bonding package lid | Shih-Yen Lin, Yu-Chih Liu, Wei-Ting Lin, Kuan-Lin Ho | 2020-12-29 |