Issued Patents All Time
Showing 26–50 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867835 | Semiconductor packaging structure and process | Kuan-Lin Ho, Wei-Ting Lin, Yu-Chih Liu, Shih-Yen Lin | 2020-12-15 |
| 10804245 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang | 2020-10-13 |
| 10700031 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang | 2020-06-30 |
| 10685853 | Lid attach processes for semiconductor packages | Wei-Ting Lin, Yu-Chih Liu, Kuan-Lin Ho, Jason Shen | 2020-06-16 |
| 10658263 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen | 2020-05-19 |
| 10622278 | Semiconductor structure and associated method for manufacturing the same | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang | 2020-04-14 |
| 10515941 | Methods of forming package-on-package structures | Yu-Chih Liu, Kuan-Lin Ho, Wei-Ting Lin, Jing Ruei Lu | 2019-12-24 |
| 10276508 | Semiconductor packages and methods of forming the same | Kuan-Lin Ho, Chi-Yang Yu, Yu-Min Liang | 2019-04-30 |
| 10269679 | Semiconductor structure and associated method for manufacturing the same | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang | 2019-04-23 |
| 10269668 | System and method for bonding package lid | Shih-Yen Lin, Yu-Chih Liu, Wei-Ting Lin, Kuan-Lin Ho | 2019-04-23 |
| 10163754 | Lid design for heat dissipation enhancement of die package | Kuan-Lin Ho, Sheng-Hsiang Chiu, Hsin-Yu Pan, Yu-Chih Liu | 2018-12-25 |
| 10157871 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang | 2018-12-18 |
| 10157772 | Semiconductor packaging structure and process | Kuan-Lin Ho, Wei-Ting Lin, Yu-Chih Liu, Shih-Yen Lin | 2018-12-18 |
| 10157863 | Method for forming a lid structure for a semiconductor device package | Kuan-Lin Ho, Chi-Yang Yu, Yu-Chih Liu | 2018-12-18 |
| 10141201 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Chi-Yang Yu, Jung Wei Cheng | 2018-11-27 |
| 9941186 | Method for manufacturing semiconductor structure | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang | 2018-04-10 |
| 9893043 | Method of manufacturing a chip package | Yu-Chih Liu, Kuan-Lin Ho, Wei-Ting Lin, Shih-Yen Lin | 2018-02-13 |
| 9865566 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang | 2018-01-09 |
| 9859265 | Package structure and methods of forming the same | Yu-Chih Liu, Kuan-Lin Ho, Wei-Ting Lin, Jing Ruei Lu | 2018-01-02 |
| 9812410 | Lid structure for a semiconductor device package and method for forming the same | Kuan-Lin Ho, Chi-Yang Yu, Yu-Chih Liu | 2017-11-07 |
| 9805997 | Packaging methods for semiconductor devices with encapsulant ring | Yu-Chih Liu, Chien-Kuo Chang, Wei-Ting Lin, Kuan-Lin Ho, Shih-Yen Lin | 2017-10-31 |
| 9786520 | Semiconductor device and manufacturing method thereof | Yu-Chih Liu, Chang-Chia Huang, Shih-Yen Lin, Kuan-Lin Ho, Wei-Ting Lin | 2017-10-10 |
| 9735043 | Semiconductor packaging structure and process | Kuan-Lin Ho, Wei-Ting Lin, Yu-Chih Liu, Shih-Yen Lin | 2017-08-15 |
| 9673119 | System and method for bonding package lid | Shih-Yen Lin, Yu-Chih Liu, Wei-Ting Lin, Kuan-Lin Ho | 2017-06-06 |
| 9502373 | Lid attach process and apparatus for fabrication of semiconductor packages | Wei-Ting Lin, Yu-Chih Liu, Kuan-Lin Ho, Jason Shen | 2016-11-22 |