Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12429907 | Electronic devices with flexible display cover layers | Hoon Kim, Terry C. Lam, Paul S. Drzaic, Yasmin F. Afsar, Young Cheol Yang +1 more | 2025-09-30 |
| 12213267 | Electronic devices having folding expandable displays | Owen D. Hale, Tatsuya Sano, Yasmin F. Afsar, Hoon Kim, Michael B. Wittenberg | 2025-01-28 |
| 12115771 | Electronic devices with multilayer adhesive | Xiaowei Wu, Hoon Kim, Yuxi Zhao, Terry C. Lam, Yasmin F. Afsar +3 more | 2024-10-15 |
| 12087187 | Electronic devices with deformation-resistant displays | Yasmin F. Afsar, Ben Hightower, Bhadrinarayana Lalgudi Visweswaran, Hoon Kim, Paul S. Drzaic +4 more | 2024-09-10 |
| 11991901 | Electronic devices with flexible display cover layers | Hoon Kim, Terry C. Lam, Paul S. Drzaic, Yasmin F. Afsar, Young Cheol Yang +1 more | 2024-05-21 |
| 11961946 | Electronic devices with flexible displays | Hoon Kim, Paul S. Drzaic, Terry C. Lam, Yasmin F. Afsar, Zhichun Shao | 2024-04-16 |
| 11901320 | Contact pad for semiconductor device | Tsung-Shu Lin, Cheng-Chieh Hsieh, Wei-Cheng Wu | 2024-02-13 |
| 11846984 | Hybrid coverlay/window structure for flexible display applications | Hoon Kim, Christopher D. Jones, Masato Kuwabara, Nikhil Kalyankar, Terry C. Shyu +2 more | 2023-12-19 |
| 11647648 | Electronic devices with flexible display cover layers | Hoon Kim, Terry C. Lam, Paul S. Drzaic, Yasmin F. Afsar, Young Cheol Yang +1 more | 2023-05-09 |
| 11527502 | Contact pad for semiconductor device | Tsung-Shu Lin, Cheng-Chieh Hsieh, Wei-Cheng Wu | 2022-12-13 |
| 11442503 | Wearable bands with embedded circuitry | Yung-Yu Hsu, Shubham A. Gandhi, Mingjing Ha, Paul S. Drzaic, Han-Chieh Chang +7 more | 2022-09-13 |
| 11444268 | Electronic devices with flexible display cover layers | Hoon Kim, Terry C. Lam, Paul S. Drzaic, Yasmin F. Afsar, Young Cheol Yang +1 more | 2022-09-13 |
| 11402868 | Hybrid coverlay/window structure for flexible display applications | Hoon Kim, Christopher D. Jones, Masato Kuwabara, Nikhil Kalyankar, Terry C. Shyu +2 more | 2022-08-02 |
| 10930605 | Contact pad for semiconductor device | Tsung-Shu Lin, Cheng-Chieh Hsieh, Wei-Cheng Wu | 2021-02-23 |
| 10817016 | Hybrid coverlay/window structure for flexible display applications | Hoon Kim, Christopher D. Jones, Masato Kuwabara, Nikhil Kalyankar, Terry C. Shyu +2 more | 2020-10-27 |
| 10700033 | Packaging device and method of making the same | Tsung-Shu Lin, Ming-Da Cheng, Wen-Hsiung Lu, Bor-Rung Su | 2020-06-30 |
| 10453813 | Contact pad for semiconductor device | Tsung-Shu Lin, Cheng-Chieh Hsieh, Wei-Cheng Wu | 2019-10-22 |
| 10050001 | Packaging device and method of making the same | Tsung-Shu Lin, Ming-Da Cheng, Wen-Hsiung Lu, Bor-Rung Su | 2018-08-14 |
| 9978656 | Mechanisms for forming fine-pitch copper bump structures | Tsung-Shu Lin, Han-Ping Pu, Ming-Da Cheng, Hao-Juin Liu | 2018-05-22 |
| 9953939 | Conductive contacts having varying widths and method of manufacturing same | Yen-Liang Lin, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2018-04-24 |
| 9786520 | Semiconductor device and manufacturing method thereof | Yu-Chih Liu, Shih-Yen Lin, Chin-Liang Chen, Kuan-Lin Ho, Wei-Ting Lin | 2017-10-10 |
| 9691686 | Contact pad for semiconductor device | Tsung-Shu Lin, Cheng-Chieh Hsieh, Wei-Cheng Wu | 2017-06-27 |
| 9613931 | Fan-out stacked system in package (SIP) having dummy dies and methods of making the same | Tsung-Shu Lin, Hsien-Wei Chen, Cheng-Chieh Hsieh | 2017-04-04 |
| 9583367 | Methods and apparatus for bump-on-trace chip packaging | Chen-Shien Chen, Sheng-Yu Wu, Tin-Hao Kuo, Yen-Liang Lin | 2017-02-28 |
| 9508668 | Conductive contacts having varying widths and method of manufacturing same | Yen-Liang Lin, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2016-11-29 |