| 11088102 |
Bonded structures for package and substrate |
Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Yao-Chun Chuang +1 more |
2021-08-10 |
| 10867810 |
Substrate pad structure |
Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen |
2020-12-15 |
| 10748785 |
Substrate pad structure |
Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen |
2020-08-18 |
| 10468366 |
Bonded structures for package and substrate |
Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Yao-Chun Chuang +1 more |
2019-11-05 |
| 10037973 |
Method for manufacturing semiconductor package structure |
Hua-Wei Tseng, Shang-Yun Tu, Hsu-Hsien Chen, Chen-Shien Chen, Ming Hung Tseng +1 more |
2018-07-31 |
| 9978656 |
Mechanisms for forming fine-pitch copper bump structures |
Tsung-Shu Lin, Han-Ping Pu, Ming-Da Cheng, Chang-Chia Huang |
2018-05-22 |
| 9741589 |
Substrate pad structure |
Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen |
2017-08-22 |
| 9673161 |
Bonded structures for package and substrate |
Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Yao-Chun Chuang +1 more |
2017-06-06 |
| 9673125 |
Interconnection structure |
Yao-Chun Chuang, Chita Chuang, Yu-Jen Tseng, Chen-Shien Chen |
2017-06-06 |
| 9472521 |
Scheme for connector site spacing and resulting structures |
Yao-Chun Chuang, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen |
2016-10-18 |
| 9406629 |
Semiconductor package structure and manufacturing method thereof |
Hua-Wei Tseng, Shang-Yun Tu, Hsu-Hsien Chen, Chen-Shien Chen, Ming Hung Tseng +1 more |
2016-08-02 |
| 9397059 |
Bonded structures for package and substrate |
Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Yao-Chun Chuang +1 more |
2016-07-19 |
| 9287191 |
Semiconductor device package and method |
Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen |
2016-03-15 |
| 9257412 |
Stress reduction apparatus |
Yao-Chun Chuang, Yu-Chen Hsu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen |
2016-02-09 |
| 9123788 |
Bonded structures for package and substrate |
Ming-Hong Cha, Chita Chuang, Yao-Chun Chuang, Tsung-Hsien Chiang, Chen-Cheng Kuo +1 more |
2015-09-01 |
| 9117825 |
Substrate pad structure |
Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen |
2015-08-25 |
| 9040350 |
Packaging and function tests for package-on-package and system-in-package structures |
Chita Chuang, Ching-Wen Hsiao, Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen |
2015-05-26 |
| 8829673 |
Bonded structures for package and substrate |
Ming-Hong Cha, Chita Chuang, Yao-Chun Chuang, Tsung-Hsien Chiang, Chen-Cheng Kuo +1 more |
2014-09-09 |
| 8765497 |
Packaging and function tests for package-on-package and system-in-package structures |
Chita Chuang, Ching-Wen Hsiao, Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen |
2014-07-01 |
