Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354238 | Image fusion | Wen-Chun Feng, Mian Li, Hsuan-Ming Liu | 2025-07-08 |
| 12191224 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh +3 more | 2025-01-07 |
| 12113055 | Stress reduction apparatus and method | Yao-Chun Chuang, Hao-Chun Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2024-10-08 |
| 11515229 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh +3 more | 2022-11-29 |
| 11244940 | Stress reduction apparatus and method | Yao-Chun Chuang, Hao-Chun Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2022-02-08 |
| 10692848 | Stress reduction apparatus and method | Yao-Chun Chuang, Hao-Chun Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2020-06-23 |
| 10436818 | Probe module having cantilever MEMS probe and method of making the same | Yu-Wen Wang, Horng-Kuang Fan, Mao-Fa Shen | 2019-10-08 |
| 10366971 | Pre-applying supporting materials between bonded package components | Yu-Feng Chen, Han-Ping Pu, Meng-Tse Chen, Guan-Yu Chen | 2019-07-30 |
| 10290919 | Electronic device | Ching-Pin Hsu, Chien-An Chou | 2019-05-14 |
| 9780046 | Seal rings structures in semiconductor device interconnect layers and methods of forming the same | Hsin-Yu Pan, Han-Ping Pu, Pei-Haw Tsao | 2017-10-03 |
| 9673184 | Packages with molding material forming steps | Chun-Hung Lin, Yu-Feng Chen, Han-Ping Pu | 2017-06-06 |
| 9293404 | Pre-applying supporting materials between bonded package components | Yu-Feng Chen, Han-Ping Pu, Meng-Tse Chen, Guan-Yu Chen | 2016-03-22 |
| 9257412 | Stress reduction apparatus | Yao-Chun Chuang, Hao-Juin Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2016-02-09 |
| 9053990 | Bump interconnection techniques | Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2015-06-09 |
| 8970024 | Packages with molding material forming steps | Chun-Hung Lin, Yu-Feng Chen, Han-Ping Pu | 2015-03-03 |
| 8797255 | Electronic-ink display panel | Chi-Ming Wu | 2014-08-05 |
| 8643577 | Repairing method and structure of display electrode | Chih-Chien Chiou, Chi-Ming Wu | 2014-02-04 |
| 8115202 | Thin film transistor array substrate and electronic ink display device | Chuan-Feng Liu, Chia-Hao Kuo | 2012-02-14 |
| 8063314 | Pin definition layout of electronic paper display screen | Chi-Meng Wu, Ya-Rou Chen, Heng-Hao Chang, Chun-Ta Chien, Chien Pang HUANG +1 more | 2011-11-22 |
| 7884363 | Electronic-ink display apparatus and the manufacturing method thereof | Chi-Ming Wu | 2011-02-08 |
| 7816190 | E-ink display and method for repairing the same | Chi-Ming Wu | 2010-10-19 |
| 7687806 | E-ink display and method for repairing the same | Chi-Ming Wu | 2010-03-30 |
| 7267472 | Light source protective structure of a backlight module | Deng-Kuen Shiau, Shr-Bin Lin, Wei-Chih Chiu, Chia-Hong Chen, Chia-Yun Hsu | 2007-09-11 |
| 7264365 | Lamp positioning structure | Yi-Chen Kuo, Wei-Chih Chiu, Hsin-Chih Chen, Shr-Bin Lin, Kuang-Yu Fan | 2007-09-04 |