Issued Patents All Time
Showing 1–25 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322726 | Method of forming an integrated circuit package having a padding layer on a carrier | Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Wei-Chih Lai | 2025-06-03 |
| 12191224 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +3 more | 2025-01-07 |
| 11955439 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin | 2024-04-09 |
| 11855018 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2023-12-26 |
| 11830745 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2023-11-28 |
| 11652063 | Semiconductor package and method of forming the same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2023-05-16 |
| 11612057 | Opening in the pad for bonding integrated passive device in InFO package | Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2023-03-21 |
| 11581268 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin | 2023-02-14 |
| 11515229 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +3 more | 2022-11-29 |
| 11508695 | Redistribution layers in semiconductor packages and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2022-11-22 |
| 11470720 | Opening in the pad for bonding integrated passive device in InFO package | Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2022-10-11 |
| 11195802 | Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin | 2021-12-07 |
| 11069625 | Method for forming package structure | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu | 2021-07-20 |
| 11069539 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2021-07-20 |
| 11018088 | Dummy features in redistribution layers (RDLS) and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2021-05-25 |
| 10950577 | Redistribution layers in semiconductor packages and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2021-03-16 |
| 10939551 | Opening in the pad for bonding integrated passive device in InFO package | Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2021-03-02 |
| 10867900 | Dummy metal with zigzagged edges | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2020-12-15 |
| 10833030 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2020-11-10 |
| 10818800 | Semiconductor structure and method for preparing the same | Tseng-Fu Lu, Jhen-Yu Tsai, Ching-Chia Huang, Wei-Ming Liao | 2020-10-27 |
| 10763212 | Semiconductor structure | Ching-Chia Huang, Chen-Lun Ting, Tseng-Fu Lu, Wei-Ming Liao | 2020-09-01 |
| 10714426 | Semiconductor package and method of forming the same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2020-07-14 |
| 10700045 | Surface mount device/integrated passive device on package or device structure and methods of forming | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu | 2020-06-30 |
| 10665474 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2020-05-26 |
| 10629537 | Conductive vias in semiconductor packages and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2020-04-21 |