Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412776 | Method for manufacturing semiconductor stack structure with ultra thin die | — | 2025-09-09 |
| 12374581 | Method for manufacturing semiconductor stack structure with ultra thin die | — | 2025-07-29 |
| 12374674 | Semiconductor structure and semiconductor device | Chun-Wei Chang, Shang-Pin Chen, Wei-Chih Chen, Che-Yen Huang | 2025-07-29 |
| 12224227 | Method for manufacturing semiconductor structure with power connecting structures under transistors and semiconductor structure with power connecting structures under transistors | Wei-Chih Chen | 2025-02-11 |
| 11830745 | 3D packages and methods for forming the same | Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2023-11-28 |
| 11715681 | Fan-out package structure and method | Sao-Ling Chiu | 2023-08-01 |
| 11107758 | Fan-out package structure and method | Sao-Ling Chiu | 2021-08-31 |
| 11069539 | 3D packages and methods for forming the same | Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2021-07-20 |
| 10665474 | 3D packages and methods for forming the same | Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2020-05-26 |
| 10510648 | Fan-out package structure and method | Sao-Ling Chiu | 2019-12-17 |
| 10269584 | 3D packages and methods for forming the same | Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2019-04-23 |
| 10163770 | Fan-out package structure and method | Sao-Ling Chiu | 2018-12-25 |
| 10056347 | Bump structure for yield improvement | Tzu-Yu Wang, Shang-Yun Hou, Shin-Puu Jeng, Hsien-Wei Chen, Hung-An Teng +1 more | 2018-08-21 |
| 9953911 | Fan-out package structure and method | Sao-Ling Chiu | 2018-04-24 |
| 9570366 | Passivation layer for packaged chip | Shin-Puu Jeng, Wei-Cheng Wu, Shang-Yun Hou, Chen-Hua Yu, Tzuan-Horng Liu +1 more | 2017-02-14 |
| 9553053 | Bump structure for yield improvement | Tzu-Yu Wang, Shang-Yun Hou, Shin-Puu Jeng, Hsien-Wei Chen, Hung-An Teng +1 more | 2017-01-24 |
| 9337118 | Stress buffer structures in a mounting structure of a semiconductor device | Tzu-Yu Wang, Shin-Puu Jeng | 2016-05-10 |
| 9299649 | 3D packages and methods for forming the same | Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2016-03-29 |
| 8906798 | Methods of manufacturing stress buffer structures in a mounting structure of a semiconductor device | Tzu-Yu Wang, Shin-Puu Jeng | 2014-12-09 |
| 8896089 | Interposers for semiconductor devices and methods of manufacture thereof | Tzu-Yu Wang, Wei-Cheng Wu, Chun-Yi Liu, Hsien-Pin Hu, Shang-Yun Hou | 2014-11-25 |
| 8587089 | Seal ring structure with polyimide layer adhesion | — | 2013-11-19 |
| 8558229 | Passivation layer for packaged chip | Shin-Puu Jeng, Wei-Cheng Wu, Shang-Yun Hou, Chen-Hua Yu, Tzuan-Horng Liu +1 more | 2013-10-15 |
| 8354750 | Stress buffer structures in a mounting structure of a semiconductor device | Tzu-Yu Wang, Shin-Puu Jeng | 2013-01-15 |
| 8283781 | Semiconductor device having pad structure with stress buffer layer | Wei-Cheng Wu, Shang-Yun Hou, Shin-Puu Jeng, Tzuan-Horng Liu, Chao-Wen Shih | 2012-10-09 |