Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431435 | Semiconductor packages and methods of forming the same | Cheng-Yen Hsieh, Chun-Hui Yu, Ping-Kang Huang, Yi-Jhang Wang | 2025-09-30 |
| 12283541 | Manufacturing method of semiconductor package | Chi-Ming Huang, Ping-Kang Huang, Shang-Yun Hou | 2025-04-22 |
| 12170237 | Semiconductor structure and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Tsung-Yu Chen, Tsung-Shu Lin, Chien-Yuan Huang +1 more | 2024-12-17 |
| 12113027 | Three-dimensional integrated circuit structures and methods of forming the same | Chung-Yu Lu, Ping-Kang Huang | 2024-10-08 |
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Shang-Yun Hou, Hsien-Pin Hu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen +5 more | 2024-04-23 |
| 11916009 | Semiconductor package and manufacturing method thereof | Chi-Ming Huang, Ping-Kang Huang, Shang-Yun Hou | 2024-02-27 |
| 11901306 | Semiconductor structure | Chung-Yu Lu, Yao-Jen Chang | 2024-02-13 |
| 11810793 | Semiconductor packages and methods of forming same | Chung-Yu Lu, Ping-Kang Huang, Shang-Yun Hou | 2023-11-07 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Shang-Yun Hou, Hsien-Pin Hu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen +5 more | 2023-08-15 |
| 11728278 | Board substrates, three-dimensional integrated circuit structures and methods of forming the same | Chung-Yu Lu, Ping-Kang Huang | 2023-08-15 |
| 11715675 | Semiconductor device and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Tsung-Yu Chen, Tsung-Shu Lin, Chien-Yuan Huang +1 more | 2023-08-01 |
| 11715681 | Fan-out package structure and method | Tzu-Wei Chiu | 2023-08-01 |
| 11552054 | Package structure and method of manufacturing the same | Wei-Ting Lin, Ping-Kang Huang, Shang-Yun Hou | 2023-01-10 |
| 11545438 | Semiconductor packages and methods of forming the same | Cheng-Yen Hsieh, Chun-Hui Yu, Ping-Kang Huang, Yi-Jhang Wang | 2023-01-03 |
| 11502043 | Semiconductor structure and method for fabricating semiconductor structure | Chung-Yu Lu, Yao-Jen Chang | 2022-11-15 |
| 11495472 | Semicondutor packages and methods of forming same | Chung-Yu Lu, Ping-Kang Huang, Shang-Yun Hou | 2022-11-08 |
| 11373946 | Semiconductor package and manufacturing method thereof | Chi-Ming Huang, Ping-Kang Huang, Shang-Yun Hou | 2022-06-28 |
| 11302600 | Semiconductor device and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Tsung-Shu Lin, Tsung-Yu Chen, Chien-Yuan Huang +1 more | 2022-04-12 |
| 11152312 | Packages with interposers and methods for forming the same | Kuo-Ching Hsu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou, Shin-Puu Jeng +1 more | 2021-10-19 |
| 11107758 | Fan-out package structure and method | Tzu-Wei Chiu | 2021-08-31 |
| 10978404 | Semiconductor structure and method for fabricating semiconductor structure | Chung-Yu Lu, Yao-Jen Chang | 2021-04-13 |
| 10978346 | Conductive vias in semiconductor packages and methods of forming same | Sung-Hui Huang, Hung-Pin Chang, Shang-Yun Hou, Wan-Yu Lee | 2021-04-13 |
| 10854567 | 3D packages and methods for forming the same | Shang-Yun Hou, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2020-12-01 |
| 10529679 | 3D packages and methods for forming the same | Shang-Yun Hou, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2020-01-07 |
| 10510603 | Conductive vias in semiconductor packages and methods of forming same | Sung-Hui Huang, Hung-Pin Chang, Shang-Yun Hou, Wan-Yu Lee | 2019-12-17 |