Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510648 | Fan-out package structure and method | Tzu-Wei Chiu | 2019-12-17 |
| 10163770 | Fan-out package structure and method | Tzu-Wei Chiu | 2018-12-25 |
| 9984981 | Packages with interposers and methods for forming the same | Kuo-Ching Hsu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou, Shin-Puu Jeng +1 more | 2018-05-29 |
| 9953911 | Fan-out package structure and method | Tzu-Wei Chiu | 2018-04-24 |
| 9824902 | Integrated fan-out package and method of fabricating the same | Hao-Cheng Hou, Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu, Jung Wei Cheng +2 more | 2017-11-21 |
| 9786567 | Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages | Wei-Cheng Wu, Li-Han Hsu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Lin | 2017-10-10 |
| 9633869 | Packages with interposers and methods for forming the same | Kuo-Ching Hsu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou, Shin-Puu Jeng +1 more | 2017-04-25 |
| 9581638 | Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages | Wei-Cheng Wu, Li-Han Hsu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Lin | 2017-02-28 |
| 9048231 | 3D packages and methods for forming the same | Shang-Yun Hou, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2015-06-02 |
| 8993378 | Flip-chip BGA assembly process | Yu-Chih Liu, Jing Ruei Lu, Wei-Ting Lin, Hsin-Yu Pan | 2015-03-31 |
| 8836094 | Package device including an opening in a flexible substrate and methods of forming the same | Tsung-Shu Lin, Cheng-Chieh Hsieh, Hung-An Teng, Shang-Yun Hou | 2014-09-16 |
| 8802504 | 3D packages and methods for forming the same | Shang-Yun Hou, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2014-08-12 |
| 8288208 | Apparatus and methods for semiconductor packages with improved warpage | Yu-Chih Liu, Jing Ruei Lu, Wei-Ting Lin, Chien-Kuo Chang | 2012-10-16 |
| 7579694 | Electronic devices including offset conductive bumps | Jong-Rong Jan, Tsai-Hua Lu, Ling-Chen Kung | 2009-08-25 |
| 7081404 | Methods of selectively bumping integrated circuit substrates and related structures | Jong-Rong Jan, Tsai-Hua Lu, Ling-Chen Kung | 2006-07-25 |