Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7579694 | Electronic devices including offset conductive bumps | Jong-Rong Jan, Sao-Ling Chiu, Ling-Chen Kung | 2009-08-25 |
| 7081404 | Methods of selectively bumping integrated circuit substrates and related structures | Jong-Rong Jan, Sao-Ling Chiu, Ling-Chen Kung | 2006-07-25 |