Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11725120 | Carrier tape system and methods of making and using the same | Chen-Ming Kuo, Pei-Haw Tsao | 2023-08-15 |
| 11417643 | Package-on-package with redistribution structure | Yu-Chih Liu, Kuan-Lin Ho, Wei-Ting Lin, Chin-Liang Chen | 2022-08-16 |
| 11133285 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng +1 more | 2021-09-28 |
| 10515941 | Methods of forming package-on-package structures | Yu-Chih Liu, Kuan-Lin Ho, Wei-Ting Lin, Chin-Liang Chen | 2019-12-24 |
| 10269763 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng +1 more | 2019-04-23 |
| 9887144 | Ring structure for chip packaging | Wen-Yi Lin, Yu-Chih Liu, Ming-Chih Yew, Tsung-Shu Lin, Bor-Rung Su +1 more | 2018-02-06 |
| 9859265 | Package structure and methods of forming the same | Yu-Chih Liu, Kuan-Lin Ho, Wei-Ting Lin, Chin-Liang Chen | 2018-01-02 |
| 9793242 | Packages with die stack including exposed molding underfill | Yu-Chih Liu, Hai-Ming Chen, Wei-Ting Lin, Tsung-Ding Wang | 2017-10-17 |
| 9666556 | Flip chip packaging | Yu-Chih Liu, Chien-Kuo Chang, Chi-Yang Yu, Chih-Hao Lin | 2017-05-30 |
| 9627355 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng +1 more | 2017-04-18 |
| 9583474 | Package on packaging structure and methods of making same | Wen-Yi Lin, Jiun Yi Wu, Po-Yao Lin, Ming-Chih Yew | 2017-02-28 |
| 9349663 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng +1 more | 2016-05-24 |
| 9147584 | Rotating curing | Yu-Chih Liu, Ming-Chung Sung, Wei-Ting Lin, Chien-Kuo Chang | 2015-09-29 |
| 8993378 | Flip-chip BGA assembly process | Yu-Chih Liu, Wei-Ting Lin, Sao-Ling Chiu, Hsin-Yu Pan | 2015-03-31 |
| 8946888 | Package on packaging structure and methods of making same | Wen-Yi Lin, Ming-Chih Yew, Po-Yao Lin, Jiun Yi Wu | 2015-02-03 |
| 8731910 | Compensator and compensation method for audio frame loss in modified discrete cosine transform domain | Ming Wu, Zhibin Lin, Ke Peng, Zheng Deng, Xiaojun Qiu +4 more | 2014-05-20 |
| 8694325 | Hierarchical audio coding, decoding method and system | Zhibin Lin, Zheng Deng, Hao Yuan, Xiaojun Qiu, Jiali Li +3 more | 2014-04-08 |
| 8288208 | Apparatus and methods for semiconductor packages with improved warpage | Yu-Chih Liu, Wei-Ting Lin, Sao-Ling Chiu, Chien-Kuo Chang | 2012-10-16 |