Issued Patents All Time
Showing 1–25 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417993 | Chip structure | Chien-Cheng Chen | 2025-09-16 |
| 12347817 | Semiconductor device package having warpage control | Heh-Chang Huang, Fu-Jen Li, Shyue-Ter Leu | 2025-07-01 |
| 12261125 | Method for forming chip package structure | Heh-Chang Huang, Fu-Jen Li, Shyue-Ter Leu | 2025-03-25 |
| 12237226 | Dicing method for stacked semiconductor devices | Tsung-Hsing Lu, Jun He, Li-Huan Chu | 2025-02-25 |
| 12230593 | Wafer level package with polymer layer delamination prevention design and method of forming the same | Kai-Heng CHEN, Shyue-Ter Leu, Rung-De Wang, Chien-Chun Wang | 2025-02-18 |
| 12205859 | Package and printed circuit board attachment | Tsung-Hsing Lu, Li-Huan Chu | 2025-01-21 |
| 12159847 | Integrated fan-out structures and methods for forming the same | Tsui-Mei Chen, Tsung-Jen Liao, Li-Huan Chu | 2024-12-03 |
| 12051624 | Stacked semiconductor devices and methods of forming thereof | Tsung-Hsing Lu, Jun He, Li-Huan Chu | 2024-07-30 |
| 12016126 | Carrier tape system and components and methods of use | Sung-Sheng Chiu, Tsui-Mei Chen, Shih-Hsing Lin, Li-Huan Chu | 2024-06-18 |
| 11990423 | Magnetic shielding material with insulator-coated ferromagnetic particles | Tsung-Hsing Lu, Li-Huan Chu | 2024-05-21 |
| 11978729 | Semiconductor device package having warpage control and method of forming the same | Heh-Chang Huang, Fu-Jen Li, Shyue-Ter Leu | 2024-05-07 |
| 11894331 | Chip package structure, chip structure and method for forming chip structure | Chien-Cheng Chen | 2024-02-06 |
| 11804445 | Method for forming chip package structure | Heh-Chang Huang, Fu-Jen Li, Shyue-Ter Leu | 2023-10-31 |
| 11798860 | Semiconductor structure and manufacturing method thereof | Chien-Jung Wang | 2023-10-24 |
| 11725120 | Carrier tape system and methods of making and using the same | Chen-Ming Kuo, Jing Ruei Lu | 2023-08-15 |
| 11610827 | Package and printed circuit board attachment | Tsung-Hsing Lu, Li-Huan Chu | 2023-03-21 |
| 11527499 | Integrated fan-out structures and methods for forming the same | Tsui-Mei Chen, Tsung-Jen Liao, Li-Huan Chu | 2022-12-13 |
| 11495556 | Semiconductor structure having counductive bump with tapered portions and method of manufacturing the same | An Xu, Huang-Ting Hsiao, Kuo-Chin Chang | 2022-11-08 |
| 11404383 | Magnetic shielding material with insulator-coated ferromagnetic particles | Tsung-Hsing Lu, Li-Huan Chu | 2022-08-02 |
| 11240947 | Carrier tape system and components and methods of use | Sung-Sheng Chiu, Tsui-Mei Chen, Shih-Hsing Lin, Li-Huan Chu | 2022-02-01 |
| 11239143 | Semiconductor structure and manufacturing method thereof | Tsung-Hsing Lu, Li-Huan Chu | 2022-02-01 |
| 11164763 | Carrier tape system and methods of using carrier tape system | Tsung-Jen Liao, Tsui-Mei Chen | 2021-11-02 |
| 11164764 | Carrier tape system and methods of using carrier tape system | Tsung-Jen Liao, Tsui-Mei Chen | 2021-11-02 |
| 11127704 | Semiconductor device with bump structure and method of making semiconductor device | Chen-Shien Chen, Cheng-Hung Tsai, Kuo-Chin Chang, Li-Huan Chu | 2021-09-21 |
| 11101190 | Package and printed circuit board attachment | Tsung-Hsing Lu, Li-Huan Chu | 2021-08-24 |