Issued Patents All Time
Showing 51–75 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8632261 | Integrated and sealed opto-electronic device assembly | Jim Zhao, Yuan-Chieh Lin, An-Jen Yang, Yin-Tse Kao, Ashish Raheja | 2014-01-21 |
| 8554034 | Optical-electrical hybrid transmission cable | Wen-Du Han, Wei H. Yao | 2013-10-08 |
| 8492263 | Protected solder ball joints in wafer level chip-scale packaging | Chung Yu Wang, Chien-Hsiun Lee, Kuo-Chin Chang, Chung-Yi Lin, Bill Kiang | 2013-07-23 |
| 8433165 | Optical-electrical hybrid transmission cable | Wen-Du Han, Wei H. Yao | 2013-04-30 |
| 8285095 | Optical-electrical hybrid transmission cable | Wen-Du Han, Wei H. Yao | 2012-10-09 |
| 8251223 | Cleaning system and a package carrier for a semiconductor package | Chia-Shun Js Hsiao | 2012-08-28 |
| 8217520 | System-in-package packaging for minimizing bond wire contamination and yield loss | Bill Kiang, Liang-Chen Lin, Pao-Kang Niu, I-Tai Liu | 2012-07-10 |
| 7932601 | Enhanced copper posts for wafer level chip scale packaging | Kuo-Chin Chang, Han-Ping Pu | 2011-04-26 |
| 7896559 | Cable assembly having floatable termination | Chong Hun Yi, Kevin E. Walker, Stephen Sedio | 2011-03-01 |
| 7843058 | Flip chip packages with spacers separating heat sinks and substrates | Liang-Chen Lin, Pao-Kang Niu | 2010-11-30 |
| 7820543 | Enhanced copper posts for wafer level chip scale packaging | Kuo-Chin Chang, Han-Ping Pu | 2010-10-26 |
| 7798850 | Cable assembly having enhanced interconnection means thereof | James M. Sabo | 2010-09-21 |
| 7719122 | System-in-package packaging for minimizing bond wire contamination and yield loss | Bill Kiang, Liang-Chen Lin, Pao-Kang Niu, I-Tai Liu | 2010-05-18 |
| 7717733 | Cable assembly having enhanced interconnection device thereof | Chong Hun Yi, Jim Zhao | 2010-05-18 |
| 7679180 | Bond pad design to minimize dielectric cracking | Liang-Chen Lin, Pao-Kang Niu, I-Tai Liu, Bill Kiang | 2010-03-16 |
| 7662665 | Method for fabricating a semiconductor package including stress relieving layer for flip chip packaging | Chen-Shien Chen, Kuo-Chin Chang, Szu-Wei Lu, Chung Yu Wang, Han-Liang Tseng +1 more | 2010-02-16 |
| D609645 | Electrical plug | Chong Hun Yi, Kuan-Yu Chen | 2010-02-09 |
| 7659632 | Solder bump structure and method of manufacturing same | Bill Kiang, Pao-Kang Niu, Liang-Chen Lin, I-Tai Liu | 2010-02-09 |
| 7654871 | Electrical connector with additional mating port | Chong Hun Yi, Kuan-Yu Chen | 2010-02-02 |
| 7638887 | Package structure and fabrication method thereof | Chender Huang, Chuen-Jye Lin | 2009-12-29 |
| D606945 | Electrical connector | Chong Hun Yi, Kuan-Yu Chen | 2009-12-29 |
| 7583502 | Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC) | Hsin-Yu Pan | 2009-09-01 |
| 7559805 | Electrical connector with power contacts | Chong Hun Yi, Kuan-Yu Chen | 2009-07-14 |
| 7534143 | Electrical connector with improved wire termination arrangement | Chong Hun Yi, Kuan-Yu Chen, Gary E. Biddle | 2009-05-19 |
| 7497724 | Cable connector assembly with improved wire organizer | Jen-Guo Fong, Eric (YunChien) Lin, Joseph Tang, An-Jen Yang, Tien-Lu Kao +4 more | 2009-03-03 |