Issued Patents All Time
Showing 101–109 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6607942 | Method of fabricating as grooved heat spreader for stress reduction in an IC package | Jones Wang, Ken-Ching Chen | 2003-08-19 |
| 6596619 | Method for fabricating an under bump metallization structure | Chung Yu Wang, Chender Huang, Ken-Ching Chen, Hank Huang | 2003-07-22 |
| 6552267 | Microelectronic assembly with stiffening member | Ken-Ching Chen | 2003-04-22 |
| 6528417 | Metal patterned structure for SiN surface adhesion enhancement | Chung Yu Wang, Chender Huang, Ken-Ching Chen | 2003-03-04 |
| 6489563 | Electrical cable with grounding sleeve | Jim Zhao, Frank Quach, Yuan-Chieh Lin | 2002-12-03 |
| 6444902 | Electrical cable | Frank Quach | 2002-09-03 |
| 6400005 | Magnetic insert into mold cavity to prevent resin bleeding from bond area of pre-mold (open cavity) plastic chip carrier during molding process | Daniel Chang, Chengder Huang | 2002-06-04 |
| 6288451 | Flip-chip package utilizing a printed circuit board having a roughened surface for increasing bond strength | — | 2001-09-11 |
| 6146924 | Magnetic insert into mold cavity to prevent resin bleeding from bond area of pre-mold (open cavity) plastic chip carrier during molding process | Daniel Chang, Chengder Huang | 2000-11-14 |