Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8685834 | Fabrication method of package structure with simplified encapsulation structure and simplified wiring | Pei-Haw Tsao, Chuen-Jye Lin | 2014-04-01 |
| 7638887 | Package structure and fabrication method thereof | Pei-Haw Tsao, Chuen-Jye Lin | 2009-12-29 |
| 7443010 | Matrix form semiconductor package substrate having an electrode of serpentine shape | Pei-Haw Tsao, Chung Yu Wang | 2008-10-28 |
| 7390697 | Enhanced adhesion strength between mold resin and polyimide | Ken-Ching Chen, Pei-Haw Tsao, Jones Wang, Hank Huang | 2008-06-24 |
| 7378731 | Heat spreader and package structure utilizing the same | Pei-Haw Tsao, Allan Lin, Jeffrey Hsu | 2008-05-27 |
| 7294937 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Chao-Yuan Su, Pei-Haw Tsao, Hsin-Hui Lee, Shang Y. Hou, Shin-Puu Jeng +2 more | 2007-11-13 |
| 7190066 | Heat spreader and package structure utilizing the same | Pei-Haw Tsao, Allan Lin, Jeffrey Hsu | 2007-03-13 |
| 7157734 | Semiconductor bond pad structures and methods of manufacturing thereof | Pei-Haw Tsao, Shang Y. Hou, Chao-Yuan Su, Chia-Hsiung Hsu | 2007-01-02 |
| 7126225 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Chao-Yuan Su, Pei-Haw Tsao, Hsin-Hui Lee, Shang Y. Hou, Shin-Puu Jeng +2 more | 2006-10-24 |
| 7026711 | Thermal dispensing enhancement for high performance flip chip BGA (HPFCBGA) | Daniel Lee, Chien-Hsiun Lee | 2006-04-11 |
| 7015066 | Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly | Pei-Haw Tsao, Jones Wang, Ken-Ching Chen | 2006-03-21 |
| 6998860 | Method for burn-in testing semiconductor dice | Alan G. Wood, Tim J. Corbett, Gary L. Chadwick, Larry D. Kinsman | 2006-02-14 |
| 6960518 | Buildup substrate pad pre-solder bump manufacturing | Pei-Haw Tsao, Jones Wang, Ken-Ching Chen, Hank Huang | 2005-11-01 |
| 6939789 | Method of wafer level chip scale packaging | Pei-Haw Tsao, Jones Wang, Ken-Ching Chen | 2005-09-06 |
| 6884662 | Enhanced adhesion strength between mold resin and polyimide | Ken-Ching Chen, Pei-Haw Tsao, Jones Wang, Hank Huang | 2005-04-26 |
| 6782897 | Method of protecting a passivation layer during solder bump formation | Chung Yu Wang, Pei-Haw Tsao, Ken-Ching Chen, Hank Huang | 2004-08-31 |
| 6774026 | Structure and method for low-stress concentration solder bumps | Chung Yu Wang, Pei-Haw Tsao, Ken-Ching Chen, Hank Huang | 2004-08-10 |
| 6770958 | Under bump metallization structure | Chung Yu Wang, Pei-Haw Tsao, Ken-Ching Chen, Hank Huang | 2004-08-03 |
| 6656827 | Electrical performance enhanced wafer level chip scale package with ground | Pei-Haw Tsao, Jones Wang, Ken-Ching Chen, Hank Huang | 2003-12-02 |
| 6638837 | Method for protecting the front side of semiconductor wafers | Pei-Haw Tsao, Jones Wang, Ken-Ching Chen, Hank Huang | 2003-10-28 |
| 6596619 | Method for fabricating an under bump metallization structure | Chung Yu Wang, Pei-Haw Tsao, Ken-Ching Chen, Hank Huang | 2003-07-22 |
| 6528417 | Metal patterned structure for SiN surface adhesion enhancement | Chung Yu Wang, Pei-Haw Tsao, Ken-Ching Chen | 2003-03-04 |
| 6372619 | Method for fabricating wafer level chip scale package with discrete package encapsulation | Pei-Hwa Tsao | 2002-04-16 |
| 6091251 | Discrete die burn-in for nonpackaged die | Alan G. Wood, Tim J. Corbett, Gary L. Chadwick, Larry D. Kinsman | 2000-07-18 |
| 6091250 | Discrete die burn-in for nonpackaged die | Alan G. Wood, Tim J. Corbett, Gary L. Chadwick, Larry D. Kinsman | 2000-07-18 |