Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7294937 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Chao-Yuan Su, Pei-Haw Tsao, Hsin-Hui Lee, Chender Huang, Shin-Puu Jeng +2 more | 2007-11-13 |
| 7157734 | Semiconductor bond pad structures and methods of manufacturing thereof | Pei-Haw Tsao, Chender Huang, Chao-Yuan Su, Chia-Hsiung Hsu | 2007-01-02 |
| 7126225 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Chao-Yuan Su, Pei-Haw Tsao, Hsin-Hui Lee, Chender Huang, Shin-Puu Jeng +2 more | 2006-10-24 |