CH

Chender Huang

TSMC: 22 patents #1,516 of 12,232Top 15%
Micron: 6 patents #2,080 of 6,345Top 35%
📍 Boise, ID: #353 of 3,546 inventorsTop 10%
🗺 Idaho: #490 of 8,810 inventorsTop 6%
Overall (All Time): #132,245 of 4,157,543Top 4%
29
Patents All Time

Issued Patents All Time

Showing 26–29 of 29 patents

Patent #TitleCo-InventorsDate
5322207 Method and apparatus for wire bonding semiconductor dice to a leadframe Rich Fogal, Mike Ball 1994-06-21
5302891 Discrete die burn-in for non-packaged die Alan G. Wood, Tim J. Corbett, Gary L. Chadwick, Larry D. Kinsman 1994-04-12
5214845 Method for producing high speed integrated circuits Jerrold L. King, Walter L. Moden 1993-06-01
5150194 Anti-bow zip lead frame design Jerry M. Brooks 1992-09-22