Issued Patents All Time
Showing 25 most recent of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7091061 | Method of forming a stack of packaged memory dice | Jerry M. Brooks | 2006-08-15 |
| 7038315 | Semiconductor chip package | Jerry M. Brooks | 2006-05-02 |
| 7005731 | Plastic lead frames for semiconductor devices and packages including same | Tongbi Jiang | 2006-02-28 |
| 6979889 | Plastic lead frames for semiconductor devices | Tongbi Jiang | 2005-12-27 |
| 6906409 | Multichip semiconductor package | Jerry M. Brooks | 2005-06-14 |
| 6897553 | Apparatus for forming a stack of packaged memory dice | Jerry M. Brooks | 2005-05-24 |
| 6884654 | Method of forming a stack of packaged memory dice | Jerry M. Brooks | 2005-04-26 |
| 6872600 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Tongbi Jiang | 2005-03-29 |
| 6841422 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Tongbi Jiang | 2005-01-11 |
| 6836003 | Integrated circuit package alignment feature | David J. Corisis, Tracy V. Reynolds, Michael Slaughter, Daniel P. Cram, Leland R. Nevill | 2004-12-28 |
| 6787399 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Tongbi Jiang | 2004-09-07 |
| 6781848 | Single-piece molded module housing | Warren M. Farnworth | 2004-08-24 |
| 6773955 | Low profile multi-IC chip package connector | Walter L. Moden, Jerry M. Brooks | 2004-08-10 |
| 6762485 | Plastic lead frames for semiconductor devices | Tongbi Jiang | 2004-07-13 |
| 6740545 | Adhesion enhanced semiconductor die for mold compound packaging | J. Mike Brooks, Walter L. Moden | 2004-05-25 |
| 6724073 | Plastic lead frames for semiconductor devices and packages including same | Tongbi Jiang | 2004-04-20 |
| 6686655 | Low profile multi-IC chip package connector | Walter L. Moden, Jerry M. Brooks | 2004-02-03 |
| 6682946 | Method of using a semiconductor chip package | Leland R. Nevill | 2004-01-27 |
| 6677671 | Apparatus for forming a stack of packaged memory dice | Jerry M. Brooks | 2004-01-13 |
| 6670720 | Semiconductor chip package with alignment structure | Leland R. Nevill | 2003-12-30 |
| 6656767 | Method of forming a stack of packaged memory dice | Jerry M. Brooks | 2003-12-02 |
| 6590277 | Reduced stress LOC assembly | Larry D. Kinsman, Jerry M. Brooks, David J. Corisis | 2003-07-08 |
| 6570771 | Single-piece molded module housing | Warren M. Farnworth | 2003-05-27 |
| 6559519 | Integrated circuit device having cyanate ester buffer coat and method of fabricating same | J. Mike Brooks, Kevin Schofield | 2003-05-06 |
| 6544820 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Tongbi Jiang | 2003-04-08 |