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Jerrold L. King — 78 Patents

Micron: 76 patents #208 of 6,374Top 4%

AMD: 1 patents #8,644 of 9,280Top 95%

Boise, ID: #108 of 3,546 inventorsTop 4%

Idaho: #147 of 8,810 inventorsTop 2%

Overall (All Time): #23,712 of 4,157,543Top 1%

78 Patents All Time

Jerrold L. King has been granted 78 US patents while listed as an inventor at Micron. The first was granted in 1992 and the most recent in August 2006. Jerrold L. King ranks #23,712 of 4,157,543 US inventors in our database (top 0.57%). Patent records list Jerrold L. King in Boise, ID, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 78 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
7091061	Method of forming a stack of packaged memory dice	Jerry M. Brooks	2006-08-15	$2,310,000
7038315	Semiconductor chip package	Jerry M. Brooks	2006-05-02	$2,317,000
7005731	Plastic lead frames for semiconductor devices and packages including same	Tongbi Jiang	2006-02-28	$2,383,000
6979889	Plastic lead frames for semiconductor devices	Tongbi Jiang	2005-12-27	$1,583,000
6906409	Multichip semiconductor package	Jerry M. Brooks	2005-06-14	$1,402,000
6897553	Apparatus for forming a stack of packaged memory dice	Jerry M. Brooks	2005-05-24	$1,184,000
6884654	Method of forming a stack of packaged memory dice	Jerry M. Brooks	2005-04-26	$1,051,000
6872600	Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication	Tongbi Jiang	2005-03-29	$1,446,000
6841422	Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication	Tongbi Jiang	2005-01-11	$1,663,000
6836003	Integrated circuit package alignment feature	David J. Corisis, Tracy V. Reynolds, Michael Slaughter, Daniel P. Cram, Leland R. Nevill	2004-12-28	$1,491,000
6787399	Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication	Tongbi Jiang	2004-09-07	$988,000
6781848	Single-piece molded module housing	Warren M. Farnworth	2004-08-24	$1,093,000
6773955	Low profile multi-IC chip package connector	Walter L. Moden, Jerry M. Brooks	2004-08-10	$1,379,000
6762485	Plastic lead frames for semiconductor devices	Tongbi Jiang	2004-07-13	$2,280,000
6740545	Adhesion enhanced semiconductor die for mold compound packaging	J. Mike Brooks, Walter L. Moden	2004-05-25	$1,828,000
6724073	Plastic lead frames for semiconductor devices and packages including same	Tongbi Jiang	2004-04-20	$2,916,000
6686655	Low profile multi-IC chip package connector	Walter L. Moden, Jerry M. Brooks	2004-02-03	$3,037,000
6682946	Method of using a semiconductor chip package	Leland R. Nevill	2004-01-27	$3,111,000
6677671	Apparatus for forming a stack of packaged memory dice	Jerry M. Brooks	2004-01-13	$2,653,000
6670720	Semiconductor chip package with alignment structure	Leland R. Nevill	2003-12-30	$2,987,000
6656767	Method of forming a stack of packaged memory dice	Jerry M. Brooks	2003-12-02	$2,846,000
6590277	Reduced stress LOC assembly	Larry D. Kinsman, Jerry M. Brooks, David J. Corisis	2003-07-08	$3,587,000
6570771	Single-piece molded module housing	Warren M. Farnworth	2003-05-27	$3,176,000
6559519	Integrated circuit device having cyanate ester buffer coat and method of fabricating same	J. Mike Brooks, Kevin Schofield	2003-05-06	$2,389,000
6544820	Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication	Tongbi Jiang	2003-04-08	$1,677,000