Issued Patents All Time
Showing 51–75 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6198172 | Semiconductor chip package | Leland R. Nevill | 2001-03-06 |
| 6153929 | Low profile multi-IC package connector | Walter L. Moden, Jerry M. Brooks | 2000-11-28 |
| 6124151 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Tongbi Jiang | 2000-09-26 |
| 6091136 | Plastic lead frames for semiconductor devices | Tongbi Jiang | 2000-07-18 |
| 6083777 | Reduced stress LOC assembly | Larry D. Kinsman, Jerry M. Brooks, David J. Corisis | 2000-07-04 |
| 6066514 | Adhesion enhanced semiconductor die for mold compound packaging | J. Mike Brooks, Walter L. Moden | 2000-05-23 |
| 6063650 | Reduced stress LOC assembly | Larry D. Kinsman, Jerry M. Brooks, David J. Corisis | 2000-05-16 |
| 6060343 | Method of forming an integrated circuit device having cyanate ester buffer coat | J. Mike Brooks, Kevin Schofield | 2000-05-09 |
| 6057176 | Lead frame coining for semiconductor devices | — | 2000-05-02 |
| 6048744 | Integrated circuit package alignment feature | David J. Corisis, Tracy V. Reynolds, Michael Slaughter, Daniel P. Cram, Leland R. Nevill | 2000-04-11 |
| 6008073 | Method of manufacturing a bus bar structure on lead frame of semiconductor device package | David J. Corisis | 1999-12-28 |
| 5914529 | Bus bar structure on lead frame of semiconductor device package | David J. Corisis | 1999-06-22 |
| 5903046 | Integrated circuit device having cyanate ester buffer coat | J. Mike Brooks, Kevin Schofield | 1999-05-11 |
| 5892660 | Single in line memory module adapter | Warren M. Farnworth | 1999-04-06 |
| 5879965 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Tongbi Jiang | 1999-03-09 |
| 5872398 | Reduced stress LOC assembly including cantilevered leads | Larry D. Kinsman, Jerry M. Brooks, David J. Corisis | 1999-02-16 |
| 5796158 | Lead frame coining for semiconductor devices | — | 1998-08-18 |
| 5760468 | Adhesion enhanced semiconductor die for mold compound packaging | J. Mike Brooks, Walter L. Moden | 1998-06-02 |
| 5677566 | Semiconductor chip package | Jerry M. Brooks | 1997-10-14 |
| 5661901 | Method for mounting and electrically interconnecting semiconductor dice | — | 1997-09-02 |
| 5616953 | Lead frame surface finish enhancement | Syed Sajid Ahmad, Jerry M. Brooks | 1997-04-01 |
| 5583372 | Adhesion enhanced semiconductor die for mold compound packaging | J. Mike Brooks, Walter L. Moden | 1996-12-10 |
| 5440241 | Method for testing, burning-in, and manufacturing wafer scale integrated circuits and a packaged wafer assembly produced thereby | Jerry M. Brooks, Warren M. Farnworth, George P. McGill | 1995-08-08 |
| 5286679 | Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer | Warren M. Farnworth, Ed A. Shrock, Scott Clifford, Walter L. Moden | 1994-02-15 |
| 5214845 | Method for producing high speed integrated circuits | Walter L. Moden, Chender Huang | 1993-06-01 |