Issued Patents All Time
Showing 1–25 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7928579 | Devices including sloped vias in a substrate and devices including spring-like deflecting contacts | James M. Wark | 2011-04-19 |
| 7589010 | Semiconductor devices with permanent polymer stencil and method for manufacturing the same | Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Michael E. Hess +1 more | 2009-09-15 |
| 7390740 | Sloped vias in a substrate, spring-like contacts, and methods of making | James M. Wark | 2008-06-24 |
| 7169693 | Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same | Salman Akram | 2007-01-30 |
| 7095106 | Collars, support structures, and forms for protruding conductive structures | Salman Akram | 2006-08-22 |
| 7087116 | Apparatus for modifying the configuration of an exposed surface of a viscous fluid | Walter L. Moden, Gregory M. Chapman, Tongbi Jiang | 2006-08-08 |
| 7041533 | Stereolithographic method for fabricating stabilizers for semiconductor devices | Salman Akram | 2006-05-09 |
| 6998334 | Semiconductor devices with permanent polymer stencil and method for manufacturing the same | Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Michael E. Hess +1 more | 2006-02-14 |
| 6983551 | Interconnecting substrates for electrical coupling of microelectronic components | — | 2006-01-10 |
| 6982386 | Interconnecting substrates for electrical coupling of microelectronic components | — | 2006-01-03 |
| 6979598 | Method of attaching a leadframe to singulated semiconductor dice | Tongbi Jiang, Walter L. Moden | 2005-12-27 |
| 6946732 | Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the same | Salman Akram | 2005-09-20 |
| 6919229 | Method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid | — | 2005-07-19 |
| 6911735 | Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same | Salman Akram | 2005-06-28 |
| 6890384 | Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid | Walter L. Moden, Gregory M. Chapman, Tongbi Jiang | 2005-05-10 |
| 6818460 | Method for applying adhesives to a lead frame | Walter L. Moden, Gregory M. Chapman, Tongbi Jiang | 2004-11-16 |
| 6803657 | Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components | Tongbi Jiang | 2004-10-12 |
| 6796028 | Method of Interconnecting substrates for electrical coupling of microelectronic components | — | 2004-09-28 |
| 6706559 | Method of attaching a leadframe to singulated semiconductor dice | Tongbi Jiang, Walter L. Moden | 2004-03-16 |
| 6703260 | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes | — | 2004-03-09 |
| 6642730 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour +2 more | 2003-11-04 |
| 6602730 | Method for gravitation-assisted control of spread of viscous material applied to a substrate | Tongbi Jiang | 2003-08-05 |
| 6569753 | Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same | Salman Akram | 2003-05-27 |
| 6544461 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour +2 more | 2003-04-08 |
| 6528867 | Integrated circuit devices including connection components mechanically and electrically attached to semiconductor dice | — | 2003-03-04 |