Issued Patents All Time
Showing 51–55 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5994784 | Die positioning in integrated circuit packaging | — | 1999-11-30 |
| 5960712 | Screens for use in a screen printing system | Tongbi Jiang | 1999-10-05 |
| 5759875 | Reduced filler particle size encapsulant for reduction in die surface damage in LOC packages and method of use | — | 1998-06-02 |
| 5616953 | Lead frame surface finish enhancement | Jerrold L. King, Jerry M. Brooks | 1997-04-01 |
| 4810523 | Pressure-sensitive adhesives | Jeffrey D. Williams, Marvin L. Young, Jackson A. Ransohoff | 1989-03-07 |