Issued Patents All Time
Showing 25 most recent of 170 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8115269 | Integrated circuit package having reduced interconnects | Warren M. Farnworth | 2012-02-14 |
| RE43112 | Stackable ball grid array package | David J. Corisis, Walter L. Moden | 2012-01-17 |
| 8048715 | Multi-chip module and methods | David J. Corisis, Matt E. Schwab | 2011-11-01 |
| 8049342 | Semiconductor device and method of fabrication thereof | Leonard E. Mess, David J. Corisis | 2011-11-01 |
| 7999378 | Semiconductor devices including semiconductor dice in laterally offset stacked arrangement | Leonard E. Mess, David J. Corisis | 2011-08-16 |
| 7998792 | Semiconductor device assemblies, electronic devices including the same and assembly methods | Leonard E. Mess, David J. Corisis | 2011-08-16 |
| 7944057 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices | David J. Corisis, Matt E. Schwab, Tracy V. Reynolds | 2011-05-17 |
| 7871859 | Vertical surface mount assembly and methods | Larry D. Kinsman, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2011-01-18 |
| 7851922 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices | David J. Corisis, Matt E. Schwab, Tracy V. Reynolds | 2010-12-14 |
| 7704794 | Method of forming a semiconductor device | Leonard E. Mess, David J. Corisis | 2010-04-27 |
| 7674652 | Methods of forming an integrated circuit package | Warren M. Farnworth | 2010-03-09 |
| 7619313 | Multi-chip module and methods | David J. Corisis, Matt E. Schwab | 2009-11-17 |
| 7423336 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices | David J. Corisis, Matt E. Schwab, Tracy V. Reynolds | 2008-09-09 |
| 7375419 | Stacked mass storage flash memory package | Leonard E. Mess, David J. Corisis | 2008-05-20 |
| 7372138 | Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods | David J. Corisis, Matt E. Schwab, Tracy V. Reynolds | 2008-05-13 |
| 7372131 | Routing element for use in semiconductor device assemblies | David J. Corisis, Matt E. Schwab, Tracy V. Reynolds | 2008-05-13 |
| 7321160 | Multi-part lead frame | S. Hinkle, David J. Corisis | 2008-01-22 |
| 7282805 | Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element | David J. Corisis, Matt E. Schwab, Tracy V. Reynolds | 2007-10-16 |
| 7282397 | Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices | David J. Corisis, Matt E. Schwab, Tracy V. Reynolds | 2007-10-16 |
| 7268013 | Method of fabricating a semiconductor die package having improved inductance characteristics | Steven G. Thummel | 2007-09-11 |
| 7262506 | Stacked mass storage flash memory package | Leonard E. Mess, David J. Corisis | 2007-08-28 |
| 7232747 | Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation | Warren M. Farnworth | 2007-06-19 |
| 7227261 | Vertical surface mount assembly and methods | Larry D. Kinsman, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2007-06-05 |
| 7193306 | Semiconductor structure having stacked semiconductor devices | Salman Akram | 2007-03-20 |
| 7125749 | Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages | Larry D. Kinsman | 2006-10-24 |