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Multi-part lead frame |
Jerry M. Brooks, David J. Corisis |
2008-01-22 |
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Semiconductor device structures including protective layers formed from healable materials |
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2007-04-03 |
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Multi-part lead frame with dissimilar materials |
Jerry M. Brooks, David J. Corisis |
2005-09-20 |
| 6902952 |
Multi-part lead frame with dissimilar materials and method of manufacturing |
Jerry M. Brooks, David J. Corisis |
2005-06-07 |
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Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein |
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2005-04-26 |
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Multi-part lead frame with dissimilar materials |
Jerry M. Brooks, David J. Corisis |
2003-05-27 |
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Multi-part lead frame with dissimilar materials and method of manufacturing |
Jerry M. Brooks, David J. Corisis |
2002-03-26 |
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Multi-part lead frame with dissimilar materials and method of manufacturing |
Jerry M. Brooks, David J. Corisis |
2000-10-31 |
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Multi-part lead frame with dissimilar materials and method of manufacturing |
Jerry M. Brooks, David J. Corisis |
2000-06-06 |
