Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
DC

David J. Corisis — 312 Patents

Micron: 297 patents #15 of 6,374Top 1%
RRRound Rock Research: 9 patents #16 of 239Top 7%
Nampa, ID: #2 of 306 inventorsTop 1%
Idaho: #9 of 8,810 inventorsTop 1%
Overall (All Time): #1,186 of 4,157,543Top 1%
312 Patents All Time
David J. Corisis has been granted 312 US patents while listed as an inventor at Micron. The first was granted in 1998 and the most recent in May 2025. David J. Corisis ranks #1,186 of 4,157,543 US inventors in our database (top 0.03%). Patent records list David J. Corisis in Nampa, ID, US.

Issued Patents All Time

Showing 1–25 of 312 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12315769 Build-up package for integrated circuit devices, and methods of making same Hong Wan Ng, Choon Kuan Lee, Chin Hui Chong 2025-05-27
11367667 Build-up package for integrated circuit devices, and methods of making same Hong Wan Ng, Choon Kuan Lee, Chin Hui Chong 2022-06-21 $17,591,000
10763185 Packaged semiconductor components having substantially rigid support members Matt E. Schwab, J. Michael Brooks 2020-09-01 $15,473,000
10692827 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Matt E. Schwab, J. Michael Brooks 2020-06-23 $14,650,000
10593607 Build-up package for integrated circuit devices, and methods of making same Hong Wan Ng, Choon Kuan Lee, Chin Hui Chong 2020-03-17 $15,937,000
10522515 Computer modules with small thicknesses and associated methods of manufacturing Kevin Gibbons, Tracy V. Reynolds 2019-12-31 $19,928,000
10448509 Electronic device assemblies including conductive vias having two or more conductive elements Choon Kuan Lee, Chin Hui Chong 2019-10-15 $10,153,000
10312173 Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components Matt E. Schwab, J. Michael Brooks 2019-06-04 $9,801,000
10297574 System in package (SIP) with dual laminate interposers Matt E. Schwab 2019-05-21 $20,228,000
10256214 Computer modules with small thicknesses and associated methods of manufacturing Kevin Gibbons, Tracy V. Reynolds 2019-04-09 $22,255,000
10211114 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Chin Hui Chong, Choon Kuan Lee 2019-02-19 $45,676,000
10163826 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Matt E. Schwab, J. Michael Brooks 2018-12-25
10008468 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Choon Kuan Lee, Chin Hui Chong 2018-06-26 $32,156,000
9960094 Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components Matt E. Schwab, J. Michael Brooks 2018-05-01 $34,806,000
9812415 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Matt E. Schwab, J. Michael Brooks 2017-11-07 $52,193,000
9768121 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Chin Hui Chong, Choon Kuan Lee 2017-09-19 $9,017,000
9717157 Computer modules with small thicknesses and associated methods of manufacturing Kevin Gibbons, Tracy V. Reynolds 2017-07-25 $29,189,000
9673121 Carrierless chip package for integrated circuit devices, and methods of making same Lee Choon Kuan, Chong Chin Hui 2017-06-06 $18,563,000
9530748 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Choon Kuan Lee, Chin Hui Chong 2016-12-27 $13,056,000
9362208 Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components Matt E. Schwab, J. Michael Brooks 2016-06-07 $8,315,000
9362260 Stacked packaged integrated circuit devices, and methods of making same Chin Hui Chong, Choon Kuan Lee 2016-06-07 $8,315,000
9362141 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Chin Hui Chong, Choon Kuan Lee 2016-06-07 $8,315,000
9355994 Build-up package for integrated circuit devices, and methods of making same Hong Wan Ng, Choon Kuan Lee, Chin Hui Chong 2016-05-31 $8,282,000
9355992 Land grid array semiconductor device packages Lee Choon Kuan, Chin Hui Chong 2016-05-31 $8,282,000
9142427 Methods of making an interposer structure with embedded capacitor structure Chin Hui Chong, Choon Kuan Lee 2015-09-22 $10,853,000