Issued Patents All Time
Showing 25 most recent of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315769 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, Choon Kuan Lee, Chin Hui Chong | 2025-05-27 |
| 11367667 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, Choon Kuan Lee, Chin Hui Chong | 2022-06-21 |
| 10763185 | Packaged semiconductor components having substantially rigid support members | Matt E. Schwab, J. Michael Brooks | 2020-09-01 |
| 10692827 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Matt E. Schwab, J. Michael Brooks | 2020-06-23 |
| 10593607 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, Choon Kuan Lee, Chin Hui Chong | 2020-03-17 |
| 10522515 | Computer modules with small thicknesses and associated methods of manufacturing | Kevin Gibbons, Tracy V. Reynolds | 2019-12-31 |
| 10448509 | Electronic device assemblies including conductive vias having two or more conductive elements | Choon Kuan Lee, Chin Hui Chong | 2019-10-15 |
| 10312173 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | Matt E. Schwab, J. Michael Brooks | 2019-06-04 |
| 10297574 | System in package (SIP) with dual laminate interposers | Matt E. Schwab | 2019-05-21 |
| 10256214 | Computer modules with small thicknesses and associated methods of manufacturing | Kevin Gibbons, Tracy V. Reynolds | 2019-04-09 |
| 10211114 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices | Chin Hui Chong, Choon Kuan Lee | 2019-02-19 |
| 10163826 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Matt E. Schwab, J. Michael Brooks | 2018-12-25 |
| 10008468 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Choon Kuan Lee, Chin Hui Chong | 2018-06-26 |
| 9960094 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | Matt E. Schwab, J. Michael Brooks | 2018-05-01 |
| 9812415 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Matt E. Schwab, J. Michael Brooks | 2017-11-07 |
| 9768121 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices | Chin Hui Chong, Choon Kuan Lee | 2017-09-19 |
| 9717157 | Computer modules with small thicknesses and associated methods of manufacturing | Kevin Gibbons, Tracy V. Reynolds | 2017-07-25 |
| 9673121 | Carrierless chip package for integrated circuit devices, and methods of making same | Lee Choon Kuan, Chong Chin Hui | 2017-06-06 |
| 9530748 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Choon Kuan Lee, Chin Hui Chong | 2016-12-27 |
| 9362208 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | Matt E. Schwab, J. Michael Brooks | 2016-06-07 |
| 9362260 | Stacked packaged integrated circuit devices, and methods of making same | Chin Hui Chong, Choon Kuan Lee | 2016-06-07 |
| 9362141 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices | Chin Hui Chong, Choon Kuan Lee | 2016-06-07 |
| 9355994 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, Choon Kuan Lee, Chin Hui Chong | 2016-05-31 |
| 9355992 | Land grid array semiconductor device packages | Lee Choon Kuan, Chin Hui Chong | 2016-05-31 |
| 9142427 | Methods of making an interposer structure with embedded capacitor structure | Chin Hui Chong, Choon Kuan Lee | 2015-09-22 |