Issued Patents All Time
Showing 25 most recent of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432859 | Surface mount device bonded to an inner layer of a multi-layer substrate | Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye, Hem Takiar | 2025-09-30 |
| 12431418 | Three dimensional semiconductor trace length matching and associated systems and methods | Chin Hui Chong, Seng Kim Ye, Kelvin Tan Aik Boo | 2025-09-30 |
| 12412811 | Split via structure for semiconductor device packaging | Seng Kim Ye, Kelvin Tan Aik Boo, Ling Pan, See Hiong Leow | 2025-09-09 |
| 12374612 | Microelectronic device packages and related methods and systems | Kelvin Tan Aik Boo, Wen Wei Lum | 2025-07-29 |
| 12368113 | Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devices | Faxing Che, Yeow Chon Ong, Wei Yu, Ling Pan, Lin-Kai Bu | 2025-07-22 |
| 12362255 | Apparatus including direct-contact heat paths and methods of manufacturing the same | Kelvin Tan Aik Boo, Seng Kim Ye, Chin Hui Chong | 2025-07-15 |
| 12362247 | Semiconductor devices with flexible spacer including a support structure and methods of making the same | Faxing Che, Wei Yu, Yeow Chon Ong, Shin Yueh Yang | 2025-07-15 |
| 12362319 | Cross stack bridge bonding devices and associated methods | Seng Kim Ye, Kelvin Tan Aik Boo, Chin Hui Chong | 2025-07-15 |
| 12354939 | Multi-role semiconductor device substrates, semiconductor device assemblies employing the same, and methods for forming the same | Chin Hui Chong, Kelvin Tan Aik Boo, Seng Kim Ye | 2025-07-08 |
| 12315769 | Build-up package for integrated circuit devices, and methods of making same | Choon Kuan Lee, David J. Corisis, Chin Hui Chong | 2025-05-27 |
| 12293992 | Semiconductor assemblies with systems and methods for managing high die stack structures | Kelvin Tan Aik Boo, Seng Kim Ye, Chin Hui Chong | 2025-05-06 |
| 12243807 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Chin Hui Chong, Hem Takiar, Seng Kim Ye, Kelvin Tan Aik Boo | 2025-03-04 |
| 12237301 | Through stack bridge bonding devices and associated methods | Chin Hui Chong, Seng Kim Ye, Kelvin Tan Aik Boo | 2025-02-25 |
| 12148736 | Three-dimensional bonding scheme and associated systems and methods | Kelvin Tan Aik Boo, Seng Kim Ye, Chin Hui Chong | 2024-11-19 |
| 12080616 | Reinforced semiconductor device packaging and associated systems and methods | Suresh Upadhyayula, Yeow Chon Ong | 2024-09-03 |
| 11942460 | Systems and methods for reducing the size of a semiconductor assembly | Kelvin Tan Aik Boo, Chin Hui Chong, Hem Takiar, Seng Kim Ye | 2024-03-26 |
| 11929351 | Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer | Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye, Hem Takiar | 2024-03-12 |
| 11908833 | Overlapping die stacks for nand package architecture | Enyong Tai, Hem Takiar, Li-Ping Wang | 2024-02-20 |
| 11894289 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Chin Hui Chong, Hem Takiar, Seng Kim Ye, Kelvin Tan Aik Boo | 2024-02-06 |
| 11855065 | Stacked semiconductor die assemblies with support members and associated systems and methods | Seng Kim Ye | 2023-12-26 |
| 11824044 | Stacked semiconductor die assemblies with die support members and associated systems and methods | Seng Kim Ye | 2023-11-21 |
| 11723150 | Surface mount device bonded to an inner layer of a multi-layer substrate | Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye, Hem Takiar | 2023-08-08 |
| 11710722 | Semiconductor assemblies with systems and methods for managing high die stack structures | Kelvin Tan Aik Boo, Seng Kim Ye, Chin Hui Chong | 2023-07-25 |
| 11658154 | Memory devices with controllers under memory packages and associated systems and methods | Seng Kim Ye | 2023-05-23 |
| 11562987 | Semiconductor devices with multiple substrates and die stacks | Chin Hui Chong, Hem Takiar, Seng Kim Ye, Kelvin Tan Aik Boo | 2023-01-24 |