Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368113 | Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devices | Hong Wan Ng, Yeow Chon Ong, Wei Yu, Ling Pan, Lin-Kai Bu | 2025-07-22 |
| 12362247 | Semiconductor devices with flexible spacer including a support structure and methods of making the same | Wei Yu, Yeow Chon Ong, Shin Yueh Yang, Hong Wan Ng | 2025-07-15 |
| 9012269 | Reducing warpage for fan-out wafer level packaging | Yonggang Jin, Xavier Baraton | 2015-04-21 |