Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455241 | Integrated circuit package and method of forming the same | Yonggang Jin, Kiyoshi Kuwabara | 2016-09-27 |
| 9012269 | Reducing warpage for fan-out wafer level packaging | Yonggang Jin, Faxing Che | 2015-04-21 |
| 7247928 | Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it | Patrick Laurent | 2007-07-24 |