Issued Patents All Time
Showing 25 most recent of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315769 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, David J. Corisis, Chin Hui Chong | 2025-05-27 |
| 11367667 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, David J. Corisis, Chin Hui Chong | 2022-06-21 |
| 11239128 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices | Seng Kim Ye, Chin Hui Chong, Wang Lai Lee, Roslan Bin Said | 2022-02-01 |
| 11189548 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Ai Chie Wang, Chin Hui Chong, Wuu Yean Tay | 2021-11-30 |
| 10593607 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, David J. Corisis, Chin Hui Chong | 2020-03-17 |
| 10448509 | Electronic device assemblies including conductive vias having two or more conductive elements | David J. Corisis, Chin Hui Chong | 2019-10-15 |
| 10431513 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices | Seng Kim Ye, Chin Hui Chong, Wang Lai Lee, Roslan Bin Said | 2019-10-01 |
| 10211114 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices | David J. Corisis, Chin Hui Chong | 2019-02-19 |
| 10008468 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Chin Hui Chong, David J. Corisis | 2018-06-26 |
| 9768121 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices | David J. Corisis, Chin Hui Chong | 2017-09-19 |
| 9721874 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Ai Chie Wang, Chin Hui Chong, Wuu Yean Tay | 2017-08-01 |
| 9640458 | Stacked microelectronic devices | Seng Kim Ye, Chin Hui Chong, Wang Lai Lee, Roslan Bin Said | 2017-05-02 |
| 9530748 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Chin Hui Chong, David J. Corisis | 2016-12-27 |
| 9362141 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices | David J. Corisis, Chin Hui Chong | 2016-06-07 |
| 9362260 | Stacked packaged integrated circuit devices, and methods of making same | David J. Corisis, Chin Hui Chong | 2016-06-07 |
| 9355994 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, David J. Corisis, Chin Hui Chong | 2016-05-31 |
| 9147623 | Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices | Edmund Koon Tian Lua, See Hiong Leow | 2015-09-29 |
| 9142427 | Methods of making an interposer structure with embedded capacitor structure | Chin Hui Chong, David J. Corisis | 2015-09-22 |
| 9084360 | Electronic device assemblies including conductive vias having two or more conductive elements | David J. Corisis, Chin Hui Chong | 2015-07-14 |
| 8975745 | Packaged microelectronic devices recessed in support member cavities, and associated methods | David J. Corisis, Chin Hui Chong | 2015-03-10 |
| 8963302 | Stacked packaged integrated circuit devices, and methods of making same | David J. Corisis, Chin Hui Chong | 2015-02-24 |
| 8940581 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Chin Hui Chong, David J. Corisis | 2015-01-27 |
| 8927332 | Methods of manufacturing semiconductor device assemblies including face-to-face semiconductor dice | Swee Seng Eric Tan | 2015-01-06 |
| 8869387 | Methods for making microelectronic die systems | Chin Hui Chong, David J. Corisis | 2014-10-28 |
| 8823159 | Stacked microelectronic devices | Seng Kim Ye, Chin Hui Chong, Wang Lai Lee, Roslan Bin Said | 2014-09-02 |