Patents per Year
Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11189548 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Choon Kuan Lee, Chin Hui Chong, Wuu Yean Tay | 2021-11-30 | $26,919,000 |
| 9721874 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Choon Kuan Lee, Chin Hui Chong, Wuu Yean Tay | 2017-08-01 | $20,356,000 |
| 8357566 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Choon Kuan Lee, Chin Hui Chong, Wuu Yean Tay | 2013-01-22 | $3,826,000 |
| 8283761 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Teck Kheng Lee, Voon Siong Chin | 2012-10-09 | $2,419,000 |
| 7968376 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Teck Kheng Lee, Voon Siong Chin | 2011-06-28 | $1,920,000 |
| 7612436 | Packaged microelectronic devices with a lead frame | Teck Kheng Lee, Voon Siong Chin | 2009-11-03 | $4,938,000 |