Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189548 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Ai Chie Wang, Choon Kuan Lee, Chin Hui Chong | 2021-11-30 |
| 9721874 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Ai Chie Wang, Choon Kuan Lee, Chin Hui Chong | 2017-08-01 |
| 8525320 | Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods | Meow Koon Eng, Yong Poo Chia, Suan Jeung Boon | 2013-09-03 |
| 8357566 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Ai Chie Wang, Choon Kuan Lee, Chin Hui Chong | 2013-01-22 |
| 7915718 | Apparatus for flip-chip packaging providing testing capability | Teck Kheng Lee, Kian Lee | 2011-03-29 |
| 7820459 | Methods relating to the reconstruction of semiconductor wafers for wafer level processing including forming of alignment protrusion and removal of alignment material | Yong Kian Tan | 2010-10-26 |
| 7754531 | Method for packaging microelectronic devices | Cher Khng Victor Tan | 2010-07-13 |
| 7573006 | Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing | Yong Kian Tan | 2009-08-11 |
| 7425462 | Methods relating to the reconstruction of semiconductor wafers for wafer-level processing | Yong Kian Tan | 2008-09-16 |
| 7368391 | Methods for designing carrier substrates with raised terminals | Cher Khng Victor Tan, Choon Kuan Lee, Kian Lee, Guek Har Lim, Teck Huat Poh +1 more | 2008-05-06 |
| 7285971 | Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof | Pak Hong Yee | 2007-10-23 |
| 7190074 | Reconstructed semiconductor wafers including alignment droplets contacting alignment vias | Yong Kian Tan | 2007-03-13 |
| 7116122 | Method for ball grid array chip packages having improved testing and stacking characteristics | Jeffrey Toh Tuck Fook | 2006-10-03 |
| 7071012 | Methods relating to the reconstruction of semiconductor wafers for wafer-level processing | Yong Kian Tan | 2006-07-04 |
| 7061124 | Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks | Cher Khng Victor Tan, Choon Kuan Lee, Kian Lee, Guek Har Lim, Teck Huat Poh +1 more | 2006-06-13 |
| 7030640 | Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof | Pak Hong Yee | 2006-04-18 |
| 7018871 | Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods | Cher Khng Victor Tan, Choon Kuan Lee, Kian Lee, Guek Har Lim, Teck Huat Poh +1 more | 2006-03-28 |
| 6856155 | Methods and apparatus for testing and burn-in of semiconductor devices | Yong Kian Tan, Yong Poo Chia, Siu Waf Low, Suan Jeung Boon, Soon Huat Goh | 2005-02-15 |
| 6847220 | Method for ball grid array chip packages having improved testing and stacking characteristics | Jeffrey Toh Tuck Fook | 2005-01-25 |
| 6787923 | Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks | Cher Khng Victor Tan, Choon Kuan Lee, Kian Lee, Guek Har Lim, Teck Huat Poh +1 more | 2004-09-07 |
| 6740984 | Ball grid array chip packages having improved testing and stacking characteristics | Jeffrey Toh Tuck Fook | 2004-05-25 |
| 6740983 | Method for ball grind array chip packages having improved testing and stacking characteristics | Jeffrey Toh Tuck Fook | 2004-05-25 |
| 6693363 | Ball grid array chip packages having improved testing and stacking characteristics | Jeffrey Toh Tuck Fook | 2004-02-17 |
| 6674175 | Ball grid array chip packages having improved testing and stacking characteristics | Jeffrey Toh Tuck Fook | 2004-01-06 |
| 6600335 | Method for ball grid array chip packages having improved testing and stacking characteristics | Jeffrey Toh Tuck Fook | 2003-07-29 |