Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8698295 | Super high-density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Yong Loo Neo, Bok Leng Ser | 2014-04-15 |
| 8304894 | Super high-density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Yong Loo Neo, Bok Leng Ser | 2012-11-06 |
| 8063493 | Semiconductor device assemblies and packages | Suan Jeung Boon, Yong Poo Chia, Meow Koon Eng | 2011-11-22 |
| 7884007 | Super high density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Yong Loo Neo, Bok Leng Ser | 2011-02-08 |
| 7633159 | Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages | Suan Jeung Boon, Yong Poo Chia, Meow Koon Eng | 2009-12-15 |
| 7579681 | Super high density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Yong Loo Neo, Bok Leng Ser | 2009-08-25 |
| 7553697 | Multiple chip semiconductor package | Meow Koon Eng, Yong Poo Chia, Yong Loo Neo, Suan Jeung Boon, Swee Kwang Chua +1 more | 2009-06-30 |
| 7485562 | Method of making multichip wafer level packages and computing systems incorporating same | Swee Kwang Chua, Yong Poo Chia, Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon +2 more | 2009-02-03 |
| 7368374 | Super high density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Yong Loo Neo, Bok Leng Ser | 2008-05-06 |
| 7304375 | Castellation wafer level packaging of integrated circuit chips | Suan Jeung Boon, Yong Poo Chia, Meow Koon Eng, Swee Kwang Chua, Shuang Wu Huang +2 more | 2007-12-04 |
| 7274094 | Leadless packaging for image sensor devices | Suan Jeung Boon, Yong Poo Chia, Yong Loo Neo, Swee Kwang Chua | 2007-09-25 |
| 7271027 | Castellation wafer level packaging of integrated circuit chips | Suan Jeung Boon, Yong Poo Chia, Meow Koon Eng, Swee Chua, Shuang Wu Huang +2 more | 2007-09-18 |
| 7208335 | Castellated chip-scale packages and methods for fabricating the same | Suan Jeung Boon, Yong Poo Chia, Meow Koon Eng | 2007-04-24 |
| 7193312 | Castellation wafer level packaging of integrated circuit chips | Suan Jeung Boon, Yong Poo Chia, Meow Koon Eng, Swee Kwang Chua, Shuang Wu Huang +2 more | 2007-03-20 |
| 7173330 | Multiple chip semiconductor package | Meow Koon Eng, Yong Poo Chia, Yong Loo Neo, Suan Jeung Boon, Swee Kwang Chua +1 more | 2007-02-06 |
| 7112471 | Leadless packaging for image sensor devices and methods of assembly | Suan Jeung Boon, Yong Poo Chia, Yong Loo Neo, Swee Kwang Chua | 2006-09-26 |
| 7087992 | Multichip wafer level packages and computing systems incorporating same | Swee Kwang Chua, Yong Poo Chia, Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon +2 more | 2006-08-08 |
| 6987031 | Multiple chip semiconductor package and method of fabricating same | Meow Koon Eng, Yong Poo Chia, Yong Loo Neo, Suan Jeung Boon, Swee Kwang Chua +1 more | 2006-01-17 |
| 6964881 | Multi-chip wafer level system packages and methods of forming same | Swee Kwang Chua, Yong Poo Chia, Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon +2 more | 2005-11-15 |
| 6958537 | Multiple chip semiconductor package | Meow Koon Eng, Yong Poo Chia, Yong Loo Neo, Suan Jeung Boon, Swee Kwang Chua +1 more | 2005-10-25 |
| 6882021 | Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead | Suan Jeung Boon, Yong Poo Chia, Min Yu Chan, Meow Koon Eng, Swee Kwang Chua | 2005-04-19 |
| 6856155 | Methods and apparatus for testing and burn-in of semiconductor devices | Wuu Yean Tay, Yong Kian Tan, Yong Poo Chia, Suan Jeung Boon, Soon Huat Goh | 2005-02-15 |
| 6825553 | Multichip wafer level packages and computing systems incorporating same | Swee Kwang Chua, Yong Poo Chia, Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon +2 more | 2004-11-30 |
| 6387729 | Method for adhering and sealing a silicon chip in an integrated circuit package | Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Boon Pew Chan, Tuck Fook Toh +2 more | 2002-05-14 |
| 6365833 | Integrated circuit package | Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Boon Pew Chan, Tuck Fook Toh +2 more | 2002-04-02 |