| 9418872 |
Packaged microelectronic components |
Meow Koon Eng, Sui Waf Low, Yong Poo Chia, Bok Leng Ser, Wei Zhou |
2016-08-16 |
| 6882021 |
Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead |
Suan Jeung Boon, Yong Poo Chia, Meow Koon Eng, Siu Waf Low, Swee Kwang Chua |
2005-04-19 |
| 6468831 |
Method of fabricating thin integrated circuit units |
Chew Weng Leong, Chee Kiang Yew, Pang Hup Ong, Jeffrey Toh, Boon Pew Chan |
2002-10-22 |
| 6387729 |
Method for adhering and sealing a silicon chip in an integrated circuit package |
Kian Teng Eng, Jing Sua Goh, Siu Waf Low, Boon Pew Chan, Tuck Fook Toh +2 more |
2002-05-14 |
| 6365833 |
Integrated circuit package |
Kian Teng Eng, Jing Sua Goh, Siu Waf Low, Boon Pew Chan, Tuck Fook Toh +2 more |
2002-04-02 |
| 6274929 |
Stacked double sided integrated circuit package |
Chew Weng Leong, Chee Kiang Yew, Pang Hup Ong, Jeffrey Toh, Boon Pew Chan |
2001-08-14 |
| 6236107 |
Encapsulate resin LOC package and method of fabrication |
Siu Waf Low, Jing Sua Goh |
2001-05-22 |
| 6218202 |
Semiconductor device testing and burn-in methodology |
Chee Kiang Yew, Kim Hoch Tey, Jeffrey Toh |
2001-04-17 |
| 6177723 |
Integrated circuit package and flat plate molding process for integrated circuit package |
Kian Teng Eng, Jing Sua Goh, Boon Pew Chan |
2001-01-23 |
| 6137164 |
Thin stacked integrated circuit device |
Chee Yew, Siu Waf Low |
2000-10-24 |
| 6087203 |
Method for adhering and sealing a silicon chip in an integrated circuit package |
Kian Teng Eng, Jing Sua Goh, Siu Waf Low, Boon Pew Chan, Tuck Fook Toh +2 more |
2000-07-11 |
| 6049129 |
Chip size integrated circuit package |
Chee Kiang Yew, Yong Khim Swee, Pang Hup Ong, Anthony L. Coyle |
2000-04-11 |
| 6040623 |
Slotted lead for a semiconductor device |
Jing Sua Goh |
2000-03-21 |
| 5952611 |
Flexible pin location integrated circuit package |
Kian Teng Eng, Jing Sua Goh, Siu Waf Low |
1999-09-14 |
| 5647124 |
Method of attachment of a semiconductor slotted lead to a substrate |
Jing Sua Goh |
1997-07-15 |
| 5461255 |
Multi-layered lead frame assembly for integrated circuits |
Siu Waf Low |
1995-10-24 |
| 5293065 |
Lead frame having an outlet with a larger cross sectional area than the inlet |
— |
1994-03-08 |
