Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6278616 | Modifying memory device organization in high density packages | Tito Gelsomini, Chee Kiang Yew | 2001-08-21 |
| 6049129 | Chip size integrated circuit package | Chee Kiang Yew, Min Yu Chan, Pang Hup Ong, Anthony L. Coyle | 2000-04-11 |