Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7089661 | Method for packaging small size memory cards | Piau Fong, Colin Chun Sing Lum, Matthew Chua | 2006-08-15 |
| 7042070 | Direct attachment of semiconductor chip to organic substrate | Masazumi Amagai | 2006-05-09 |
| 6768646 | High density internal ball grid array integrated circuit package | Fung Leng Chen, Pang Hup Ong | 2004-07-27 |
| 6602803 | Direct attachment semiconductor chip to organic substrate | Masazumi Amagai | 2003-08-05 |
| 6468831 | Method of fabricating thin integrated circuit units | Chew Weng Leong, Min Yu Chan, Pang Hup Ong, Jeffrey Toh, Boon Pew Chan | 2002-10-22 |
| 6387729 | Method for adhering and sealing a silicon chip in an integrated circuit package | Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Boon Pew Chan +2 more | 2002-05-14 |
| 6365833 | Integrated circuit package | Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Boon Pew Chan +2 more | 2002-04-02 |
| 6278616 | Modifying memory device organization in high density packages | Tito Gelsomini, Yong Khim Swee | 2001-08-21 |
| 6274929 | Stacked double sided integrated circuit package | Chew Weng Leong, Min Yu Chan, Pang Hup Ong, Jeffrey Toh, Boon Pew Chan | 2001-08-14 |
| 6218202 | Semiconductor device testing and burn-in methodology | Kim Hoch Tey, Min Yu Chan, Jeffrey Toh | 2001-04-17 |
| 6091140 | Thin chip-size integrated circuit package | Tuck Fook Toh, Chew Weng Leong, Pang Hup Ong | 2000-07-18 |
| 6087203 | Method for adhering and sealing a silicon chip in an integrated circuit package | Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Boon Pew Chan +2 more | 2000-07-11 |
| 6084306 | Bridging method of interconnects for integrated circuit packages | Kian Teng Eng, Ji Cheng Yang | 2000-07-04 |
| 6049129 | Chip size integrated circuit package | Yong Khim Swee, Min Yu Chan, Pang Hup Ong, Anthony L. Coyle | 2000-04-11 |
| 5956233 | High density single inline memory module | Kian Teng Eng, Sian Yong Khoo, Bok Leng Ser | 1999-09-21 |