Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE48420 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | Bernhard Lange, Quang X. Mai | 2021-02-02 |
| RE46618 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | Bernhard Lange, Quang X. Mai | 2017-11-28 |
| RE46466 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | Bernhard Lange, Quang X. Mai | 2017-07-04 |
| 8232144 | Non-pull back pad package with an additional solder standoff | Bernhard Lange, Jeffrey Gail Holloway | 2012-07-31 |
| 8154117 | High power integrated circuit device having bump pads | Stefan Wlodzimierz Wiktor, Vladimir A. Muratov, Bernhard Lange | 2012-04-10 |
| 8053876 | Multi lead frame power package | Steven Kummerl, Bernhard Lange | 2011-11-08 |
| 8053285 | Thermally enhanced single inline package (SIP) | Chris Haga, William D. Boyd | 2011-11-08 |
| 8039956 | High current semiconductor device system having low resistance and inductance | Bernhard Lange | 2011-10-18 |
| 7863098 | Flip chip package with advanced electrical and thermal properties for high current designs | Bernhard Lange | 2011-01-04 |
| 7612437 | Thermally enhanced single inline package (SIP) | Chris Haga, William D. Boyd | 2009-11-03 |
| 7608484 | Non-pull back pad package with an additional solder standoff | Bernhard Lange, Jeffrey Gail Holloway | 2009-10-27 |
| 7488623 | Integrated circuit chip packaging assembly | Steven Kummerl, Bernhard Lange | 2009-02-10 |
| 7476976 | Flip chip package with advanced electrical and thermal properties for high current designs | Bernhard Lange | 2009-01-13 |
| 7335536 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | Bernhard Lange, Quang X. Mai | 2008-02-26 |
| 7256482 | Integrated circuit chip packaging assembly | Steven Kummerl, Bernhard Lange | 2007-08-14 |
| 7084494 | Semiconductor package having integrated metal parts for thermal enhancement | William D. Boyd, Chris Haga, Leland Swanson | 2006-08-01 |
| 7026710 | Molded package for micromechanical devices and method of fabrication | George A. Bednarz | 2006-04-11 |
| 6916689 | Plastic chip-scale package having integrated passive components | Samuel D. Pritchett, Milton L. Buschbom | 2005-07-12 |
| 6858910 | Method of fabricating a molded package for micromechanical devices | George A. Bednarz | 2005-02-22 |
| 6753616 | Flip chip semiconductor device in a molded chip scale package | — | 2004-06-22 |
| 6696757 | Contact structure for reliable metallic interconnection | Mohammad Yunus | 2004-02-24 |
| 6586676 | Plastic chip-scale package having integrated passive components | Samuel D. Pritchett, Milton L. Buschbom | 2003-07-01 |
| 6541832 | Plastic package for micromechanical devices | — | 2003-04-01 |
| 6518089 | Flip chip semiconductor device in a molded chip scale package (CSP) and method of assembly | — | 2003-02-11 |
| 6489178 | Method of fabricating a molded package for micromechanical devices | George A. Bednarz | 2002-12-03 |