| 7514292 |
Individualized low parasitic power distribution lines deposited over active integrated circuits |
Taylor R. Efland, Sameer Pendharkar |
2009-04-07 |
| 7135759 |
Individualized low parasitic power distribution lines deposited over active integrated circuits |
Taylor R. Efland, Sameer Pendharkar |
2006-11-14 |
| 6916689 |
Plastic chip-scale package having integrated passive components |
Samuel D. Pritchett, Anthony L. Coyle |
2005-07-12 |
| 6800944 |
Power/ground ring substrate for integrated circuits |
— |
2004-10-05 |
| 6683380 |
Integrated circuit with bonding layer over active circuitry |
Taylor R. Efland, Donald C. Abbott, Walter Bucksch, Marco Corsi, Chi-Cheong Shen +5 more |
2004-01-27 |
| 6586676 |
Plastic chip-scale package having integrated passive components |
Samuel D. Pritchett, Anthony L. Coyle |
2003-07-01 |
| 5982186 |
Contactor for test applications including membrane carrier having contacts for an integrated circuit and pins connecting contacts to test board |
— |
1999-11-09 |
| 5892274 |
Printed circuit board ground plane and high frequency semiconductor combination |
— |
1999-04-06 |
| 5834335 |
Non-metallurgical connection between an integrated circuit and a circuit board or another integrated circuit |
— |
1998-11-10 |