Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837513 | O-ring seals for fluid sensing | Sebastian Meier | 2023-12-05 |
| 11525820 | Manufacturing fluid sensing packages | Sebastian Meier, Heinrich Wachinger | 2022-12-13 |
| RE48420 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | Anthony L. Coyle, Quang X. Mai | 2021-02-02 |
| RE46618 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | Anthony L. Coyle, Quang X. Mai | 2017-11-28 |
| RE46466 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | Anthony L. Coyle, Quang X. Mai | 2017-07-04 |
| 9458401 | Use of substituted ureas or urethanes for improvement of the use properties of mineral and synthetic nonaqueous industrial fluids | Jan Strittmatter, Karl Haeberle, Wolfgang Grabarse, Ivette Garcia Castro, Markus Hansch +3 more | 2016-10-04 |
| 8884343 | System in package and method for manufacturing the same | Juergen Neuhaeusler | 2014-11-11 |
| 8232144 | Non-pull back pad package with an additional solder standoff | Anthony L. Coyle, Jeffrey Gail Holloway | 2012-07-31 |
| 8154117 | High power integrated circuit device having bump pads | Stefan Wlodzimierz Wiktor, Vladimir A. Muratov, Anthony L. Coyle | 2012-04-10 |
| 8053876 | Multi lead frame power package | Steven Kummerl, Anthony L. Coyle | 2011-11-08 |
| 8039956 | High current semiconductor device system having low resistance and inductance | Anthony L. Coyle | 2011-10-18 |
| 7863098 | Flip chip package with advanced electrical and thermal properties for high current designs | Anthony L. Coyle | 2011-01-04 |
| 7808088 | Semiconductor device with improved high current performance | — | 2010-10-05 |
| 7741704 | Leadframe and mold compound interlock in packaged semiconductor device | Steven Kummerl | 2010-06-22 |
| 7635613 | Semiconductor device having firmly secured heat spreader | Steven Kummerl | 2009-12-22 |
| 7608484 | Non-pull back pad package with an additional solder standoff | Anthony L. Coyle, Jeffrey Gail Holloway | 2009-10-27 |
| 7578422 | Bond capillary design for ribbon wire bonding | Steven Kummerl | 2009-08-25 |
| 7531895 | Integrated circuit package and method of manufacture thereof | William D. Boyd | 2009-05-12 |
| 7488623 | Integrated circuit chip packaging assembly | Steven Kummerl, Anthony L. Coyle | 2009-02-10 |
| 7476976 | Flip chip package with advanced electrical and thermal properties for high current designs | Anthony L. Coyle | 2009-01-13 |
| 7361977 | Semiconductor assembly and packaging for high current and low inductance | — | 2008-04-22 |
| 7335536 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | Anthony L. Coyle, Quang X. Mai | 2008-02-26 |
| 7256482 | Integrated circuit chip packaging assembly | Steven Kummerl, Anthony L. Coyle | 2007-08-14 |
| 7221055 | System and method for die attach using a backside heat spreader | — | 2007-05-22 |
| 7216794 | Bond capillary design for ribbon wire bonding | Steven Kummerl | 2007-05-15 |