Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE48420 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | Bernhard Lange, Anthony L. Coyle | 2021-02-02 |
| RE46618 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | Bernhard Lange, Anthony L. Coyle | 2017-11-28 |
| RE46466 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | Bernhard Lange, Anthony L. Coyle | 2017-07-04 |
| 7413947 | Integrated high voltage capacitor having a top-level dielectric layer and a method of manufacture therefor | David Leonard Larkin, Ashish V. Gokhale, Dhaval A. Saraiya | 2008-08-19 |
| 7335536 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | Bernhard Lange, Anthony L. Coyle | 2008-02-26 |
| 6683380 | Integrated circuit with bonding layer over active circuitry | Taylor R. Efland, Donald C. Abbott, Walter Bucksch, Marco Corsi, Chi-Cheong Shen +5 more | 2004-01-27 |
| 6144100 | Integrated circuit with bonding layer over active circuitry | Chi-Cheong Shen, Donald C. Abbott, Walter Bucksch, Marco Corsi, Taylor R. Efland +4 more | 2000-11-07 |
| 6140150 | Plastic encapsulation for integrated circuits having plated copper top surface level interconnect | Taylor R. Efland, Dale J. Skelton, Charles E. Williams | 2000-10-31 |
| 6140702 | Plastic encapsulation for integrated circuits having plated copper top surface level interconnect | Taylor R. Efland, Dale J. Skelton, Charles E. Williams | 2000-10-31 |
| 6025275 | Method of forming improved thick plated copper interconnect and associated auxiliary metal interconnect | Taylor R. Efland, Charles E. Williams, Stephen A. Keller | 2000-02-15 |
| 6020640 | Thick plated interconnect and associated auxillary interconnect | Taylor R. Efland, Charles E. Williams, Stephen A. Keller | 2000-02-01 |