Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12364052 | Integrated filter optical package | Simon Joshua Jacobs, James R. Huckabee, Jo Bito, Rongwei Zhang | 2025-07-15 |
| 12211800 | Semiconductor package with shunt and patterned metal trace | Yiqi Tang, Rajen Manicon Murugan, Liang Wan, Makarand Ramkrishna Kulkarni, Jie Chen | 2025-01-28 |
| 12176298 | Floating die package | Benjamin Stassen Cook, Kurt Peter Wachtler | 2024-12-24 |
| 12087859 | Method for improving transistor performance | Matthew John Sherbin, Saumya Gandhi | 2024-09-10 |
| 12080633 | Custom leadframe from standard plus printed leadframe portion | Jo Bito, Benjamin Stassen Cook | 2024-09-03 |
| 12040197 | Mechanical couplings designed to resolve process constraints | Yuh-Harng Chien, Hung-Yu Chou, Fu-Kang Lee | 2024-07-16 |
| 11972994 | Film covers for sensor packages | Sreenivasan K. Koduri, Leslie Edward Stark, Wai Lee | 2024-04-30 |
| 11854947 | Integrated circuit chip with a vertical connector | Abram Castro | 2023-12-26 |
| 11742265 | Exposed heat-generating devices | Hung-Yu Chou, Chi-Chen Chien, Yuh-Harng Chien, Bo-Hsun Pan, Fu-Hua Yu | 2023-08-29 |
| 11735506 | Packages with multiple exposed pads | Hung-Yu Chou, Bo-Hsun Pan, Yuh-Harng Chien, Fu-Hua Yu, Jie Chen +1 more | 2023-08-22 |
| 11658083 | Film covers for sensor packages | Sreenivasan K. Koduri, Leslie Edward Stark, Wai Lee | 2023-05-23 |
| 11551986 | Shape memory polymer for use in semiconductor device fabrication | Benjamin Stassen Cook | 2023-01-10 |
| 11296016 | Semiconductor devices and methods and apparatus to produce such semiconductor devices | Robert Allan Neidorff, Benjamin Stassen Cook, Barry Jon Male, Peter Smeys | 2022-04-05 |
| 11270937 | Integrated inductor with magnetic mold compound | Dongbin Hou, Roberto Giampiero Massolini, Joyce Marie Mullenix | 2022-03-08 |
| 11081428 | Electronic device with three dimensional thermal pad | Stanley Shihyao Chou, Yuh-Harng Chien, Bo-Hsun Pan, Pi-Chiang Huang, Frank Yu +1 more | 2021-08-03 |
| 10887993 | Standoff connector for electrical devices | — | 2021-01-05 |
| 10861796 | Floating die package | Benjamin Stassen Cook, Kurt Peter Wachtler | 2020-12-08 |
| 10804185 | Integrated circuit chip with a vertical connector | Abram Castro | 2020-10-13 |
| 10553573 | Self-assembly of semiconductor die onto a leadframe using magnetic fields | Daniel Lee Revier, Benjamin Stassen Cook | 2020-02-04 |
| 10535594 | Interposer with extruded feed-through vias | — | 2020-01-14 |
| 10431684 | Method for improving transistor performance | Matthew John Sherbin, Saumya Gandhi | 2019-10-01 |
| 10340152 | Mechanical couplings designed to resolve process constraints | Yuh-Harng Chien, Hung-Yu Chou, Fu-Kang Lee | 2019-07-02 |
| 9679864 | Printed interconnects for semiconductor packages | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Matthew David Romig, Wei-Yan Shih | 2017-06-13 |
| 9646906 | Semiconductor package with printed sensor | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Django Trombley, Paul Merle Emerson | 2017-05-09 |
| 9496171 | Printed interconnects for semiconductor packages | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Matthew David Romig, Wei-Yan Shih | 2016-11-15 |