Issued Patents All Time
Showing 1–25 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237247 | Semiconductor package with top circuit and an IC with a gap over the IC | Paul Merle Emerson, Sandeep Krishnan | 2025-02-25 |
| 12187601 | Electronic sensors with sensor die in package structure cavity | Benjamin Stassen Cook, Robert A. Neidorff, Steve Kummerl | 2025-01-07 |
| 12074095 | Suspended semiconductor dies | Marco Corsi | 2024-08-27 |
| 11925119 | Thermo-electric controlled switching circuit | Henry Litzmann Edwards | 2024-03-05 |
| 11884538 | Root mean square sensor device | Marco Corsi | 2024-01-30 |
| 11837529 | Semiconductor package with top circuit and an IC with a gap over the IC | Paul Merle Emerson, Sandeep Krishnan | 2023-12-05 |
| 11538771 | Integrated circuit with an embedded inductor or transformer | Rajarshi Mukhopadhyay | 2022-12-27 |
| 11538767 | Integrated circuit package with partitioning based on environmental sensitivity | Paul Merle Emerson, Kurt Peter Wachtler | 2022-12-27 |
| 11495522 | Suspended semiconductor dies | Marco Corsi | 2022-11-08 |
| 11303108 | Galvanic isolation for relay device | Miroslav Oljaca, David W. Stout, Ajinder Singh | 2022-04-12 |
| 11302611 | Semiconductor package with top circuit and an IC with a gap over the IC | Paul Merle Emerson, Sandeep Krishnan | 2022-04-12 |
| 11296016 | Semiconductor devices and methods and apparatus to produce such semiconductor devices | Robert Allan Neidorff, Benjamin Stassen Cook, Steven Kummerl, Peter Smeys | 2022-04-05 |
| 11264369 | Isolator integrated circuits with package structure cavity and fabrication methods | Benjamin Stassen Cook, Robert A. Neidorff, Steve Kummerl | 2022-03-01 |
| 11227986 | Thermo-electric controlled switching circuit | Henry Litzmann Edwards | 2022-01-18 |
| 11211305 | Apparatus and method to support thermal management of semiconductor-based components | — | 2021-12-28 |
| 11155460 | Root mean square sensor device | Marco Corsi | 2021-10-26 |
| 10734331 | Integrated circuit with an embedded inductor or transformer | Rajarshi Mukhopadhyay | 2020-08-04 |
| 10727161 | Thermal and stress isolation for precision circuit | Peter Smeys, Ting-Ta Yen, Paul Merle Emerson | 2020-07-28 |
| 10644495 | Galvanic isolation for relay device | Miroslav Oljaca, David W. Stout, Ajinder Singh | 2020-05-05 |
| 10636778 | Isolator integrated circuits with package structure cavity and fabrication methods | Benjamin Stassen Cook, Robert A. Neidorff, Steve Kummerl | 2020-04-28 |
| 10529796 | Galvanic isolation device | Benjamin Stassen Cook, Robert A. Neidorff | 2020-01-07 |
| 10446734 | Vertical thermoelectric structures | Philip L. Hower | 2019-10-15 |
| 10424551 | Integrated circuit wave device and method | Benjamin Stassen Cook, Robert A. Neidorff, Steve Kummerl | 2019-09-24 |
| 10411150 | Optical isolation systems and circuits and photon detectors with extended lateral P-N junctions | — | 2019-09-10 |
| 10179730 | Electronic sensors with sensor die in package structure cavity | Benjamin Stassen Cook, Robert A. Neidorff, Steve Kummerl | 2019-01-15 |