Issued Patents All Time
Showing 25 most recent of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12356864 | Acoustic isolator | Mohammad Hadi Motieian Najar, Ting-Ta Yen, Ahmad Bahai | 2025-07-08 |
| 12148717 | Through wafer trench isolation between transistors in an integrated circuit | Scott R. Summerfelt, Thomas D. Bonifield, Sreeram Subramanyam Nasum, Benjamin Stassen Cook | 2024-11-19 |
| 11697135 | Multi-frequency hybrid piezo actuation and capactive transducer | Mohammad Hadi Motieian Najar | 2023-07-11 |
| 11646714 | Laterally vibrating bulk acoustic wave resonator | Jeronimo Segovia Fernandez, Ting-Ta Yen | 2023-05-09 |
| 11621694 | Lamb wave resonator-based torque sensor | Jeronimo Segovia Fernandez | 2023-04-04 |
| 11506630 | Inductive humidity sensor and method | Joyce Marie Mullenix | 2022-11-22 |
| 11489511 | Highly dispersive bulk acoustic wave resonators | Jeronimo Segovia Fernandez, Ting-Ta Yen | 2022-11-01 |
| 11296016 | Semiconductor devices and methods and apparatus to produce such semiconductor devices | Robert Allan Neidorff, Benjamin Stassen Cook, Steven Kummerl, Barry Jon Male | 2022-04-05 |
| 11264970 | Piezoelectric resonator with patterned resonant confiners | Jeronimo Segovia Fernandez, Ting-Ta Yen | 2022-03-01 |
| 11251138 | Through wafer trench isolation between transistors in an integrated circuit | Scott R. Summerfelt, Thomas D. Bonifield, Sreeram Subramanyam Nasum, Benjamin Stassen Cook | 2022-02-15 |
| 11190164 | Using acoustic reflector to reduce spurious modes | Ting-Ta Yen, Jeronimo Segovia Fernandez, Bichoy Bahr | 2021-11-30 |
| 10829367 | MEMS gap control structures | Jong Il Shin, Bongsang Kim | 2020-11-10 |
| 10751754 | Micromachined ultrasound transducer | Mohammad Hadi Motieian Najar | 2020-08-25 |
| 10727815 | Methods and apparatus to measure resonant sensors based on detection of group delay | Jeronimo Segovia Fernandez, Ali Djabbari | 2020-07-28 |
| 10727161 | Thermal and stress isolation for precision circuit | Ting-Ta Yen, Barry Jon Male, Paul Merle Emerson | 2020-07-28 |
| 10651151 | 3D integration using Al—Ge eutectic bond interconnect | Mozafar Maghsoudnia | 2020-05-12 |
| 10308503 | Dual cavity pressure structures | Jong Il Shin, Daesung Lee | 2019-06-04 |
| 10308507 | MEMS gap control structures | Jong II Shin, Bongsang Kim | 2019-06-04 |
| 10221065 | CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture | Daesung Lee, Jongwoo Shin, Jong Il Shin, Martin Lim | 2019-03-05 |
| 10093533 | CMOS-MEMS-CMOS platform | Martin Lim | 2018-10-09 |
| 9975763 | Integration of AIN ultrasonic transducer on a CMOS substrate using fusion bonding process | Jong Il Shin, Jongwoo Shin | 2018-05-22 |
| 9919915 | Method and system for MEMS devices with dual damascene formed electrodes | Chunchieh Huang | 2018-03-20 |
| 9892922 | Methods for fabricating integrated circuits with triple gate oxide devices | Ning Cheng | 2018-02-13 |
| 9862593 | MEMS-CMOS device that minimizes outgassing and methods of manufacture | Jong Il Shin, Jongwoo Shin | 2018-01-09 |
| 9809450 | CMOS-MEMS integration using metal silicide formation | Jong Il Shin, Jongwoo Shin | 2017-11-07 |