| 12489088 |
IC package with multiple dies |
— |
2025-12-02 |
|
| 12490443 |
Hybrid isolation capacitors in series |
Hongsheng Guo |
2025-12-02 |
|
| 12476170 |
High voltage flip-chip on lead (FOL) package |
Aninyda Poddar, Woochan Kim, Vikrant Arora |
2025-11-18 |
|
| 12463153 |
Single die reinforced galvanic isolation device |
Jerry B. West, Tomofumi Tamura, Yoshiko Takei |
2025-11-04 |
|
| 12355025 |
Standalone isolation capacitor |
Elizabeth Costner Stewart, Jeffrey Alan West, Byron Lovell Williams |
2025-07-08 |
|
| 12317518 |
Isolation device with safety fuse |
Honglin Guo |
2025-05-27 |
|
| 12230669 |
Standalone high voltage galvanic isolation capacitors |
Jeffrey Alan West, Byron Lovell Williams, Elizabeth Costner Stewart |
2025-02-18 |
|
| 12148717 |
Through wafer trench isolation between transistors in an integrated circuit |
Scott R. Summerfelt, Sreeram Subramanyam Nasum, Peter Smeys, Benjamin Stassen Cook |
2024-11-19 |
$56,184,000 |
| 12033936 |
Resonant inductive-capacitive isolated data channel |
Klaas De Haan, Mikhail Valeryevich Ivanov, Tobias Bernhard Fritz, Swaminathan Sankaran |
2024-07-09 |
$47,758,000 |
| 11961879 |
IC including capacitor having segmented bottom plate |
Jeffrey Alan West, Mrinal K. Das, Byron Lovell Williams, Maxim Franke |
2024-04-16 |
$53,449,000 |
| 11942402 |
Laminate stacked on die for high voltage isolation capacitor |
— |
2024-03-26 |
$28,354,000 |
| 11901402 |
Standalone isolation capacitor |
Elizabeth Costner Stewart, Jeffrey Alan West, Byron Lovell Williams |
2024-02-13 |
$26,003,000 |
| 11881449 |
High performance high voltage isolators |
Jeffrey Alan West |
2024-01-23 |
$24,621,000 |
| 11869933 |
Device isolator with reduced parasitic capacitance |
Raja Selvaraj, Anant Shankar Kamath, Byron Lovell Williams, John Kenneth Arch |
2024-01-09 |
$22,697,000 |
| 11798979 |
Integrated capacitor with sidewall having reduced roughness |
Elizabeth Costner Stewart, Jeffrey Alan West, Joseph A. Gallegos, Jay Sung Chun, Zhiyi Yu |
2023-10-24 |
$22,019,000 |
| 11784212 |
Standalone high voltage galvanic isolation capacitors |
Jeffrey Alan West, Byron Lovell Williams, Elizabeth Costner Stewart |
2023-10-10 |
$30,331,000 |
| 11688760 |
IC including capacitor having segmented bottom plate |
Jeffrey Alan West, Mrinal K. Das, Byron Lovell Williams, Maxim Franke |
2023-06-27 |
$59,344,000 |
| 11616048 |
IC package with multiple dies |
— |
2023-03-28 |
$31,423,000 |
| 11495658 |
Hybrid high and low stress oxide embedded capacitor dielectric |
Elizabeth Costner Stewart, Jeffrey Alan West |
2022-11-08 |
$30,904,000 |
| 11495553 |
Wire bonding between isolation capacitors for multichip modules |
Jeffrey Alan West, Byron Lovell Williams |
2022-11-08 |
$30,904,000 |
| 11476189 |
Resonant inductive-capacitive isolated data channel |
Klaas De Haan, Mikhail Valeryevich Ivanov, Tobias Bernhard Fritz, Swaminathan Sankaran |
2022-10-18 |
$55,090,000 |
| 11270930 |
Laminate stacked on die for high voltage isolation capacitor |
— |
2022-03-08 |
$40,508,000 |
| 11251138 |
Through wafer trench isolation between transistors in an integrated circuit |
Scott R. Summerfelt, Sreeram Subramanyam Nasum, Peter Smeys, Benjamin Stassen Cook |
2022-02-15 |
$57,544,000 |
| 11222945 |
High voltage isolation structure and method |
Kannan Soundarapandian |
2022-01-11 |
$100,936,000 |
| 11205695 |
Method of fabricating a thick oxide feature on a semiconductor wafer |
Elizabeth Costner Stewart, Jeffrey Alan West, Jay Sung Chun, Byron Lovell Williams |
2021-12-21 |
$36,896,000 |