| 12500082 |
Semicondctor device package thermal conduit |
Archana Venugopal, Luigi Colombo, Robert Reid Doering |
2025-12-16 |
|
| 12457756 |
3D printed semiconductor package |
Daniel Lee Revier |
2025-10-28 |
|
| 12317638 |
Sensor packages with wavelength-specific light filters |
Jo Bito |
2025-05-27 |
|
| 12191554 |
Acoustic waveguide with diffraction grating |
Bichoy Bahr, Scott R. Summerfelt |
2025-01-07 |
|
| 12187601 |
Electronic sensors with sensor die in package structure cavity |
Barry Jon Male, Robert A. Neidorff, Steve Kummerl |
2025-01-07 |
|
| 12172374 |
Additive process for circular printing |
Daniel Lee Revier, Sean Chang |
2024-12-24 |
$52,373,000 |
| 12176298 |
Floating die package |
Steven Kummerl, Kurt Peter Wachtler |
2024-12-24 |
$52,373,000 |
| 12148717 |
Through wafer trench isolation between transistors in an integrated circuit |
Scott R. Summerfelt, Thomas D. Bonifield, Sreeram Subramanyam Nasum, Peter Smeys |
2024-11-19 |
$56,184,000 |
| 12139569 |
Filler particles for polymers |
Nazila Dadvand, Archana Venugopal, Luigi Colombo |
2024-11-12 |
$32,376,000 |
| 12080633 |
Custom leadframe from standard plus printed leadframe portion |
Jo Bito, Steven Kummerl |
2024-09-03 |
$37,593,000 |
| 12054385 |
Stress isolation using three-dimensional trenches |
Ting-Ta Yen, Jeronimo SEGOVIA-FERNANDEZ, Ricky Alan Jackson |
2024-08-06 |
$46,957,000 |
| 12046430 |
Liquid metal MEMS switch |
Adam Joseph Fruehling, Dishit Paresh Parekh, Daniel Lee Revier |
2024-07-23 |
$32,250,000 |
| 12042829 |
Methods and apparatus for surface wetting control |
Daniel Lee Revier, David Patrick Magee, Stephen John Fedigan |
2024-07-23 |
$32,250,000 |
| 11996343 |
Thermal routing trench by additive processing |
Archana Venugopal, Luigi Colombo, Robert Reid Doering |
2024-05-28 |
$32,000,000 |
| 11948871 |
Process for thin film capacitor integration |
Yogesh Kumar Ramadass, Salvatore Frank Pavone, Mahmud Halim Chowdhury |
2024-04-02 |
$50,164,000 |
| 11938715 |
SP2-bonded carbon structures |
Luigi Colombo, Nazila Dadvand, Archana Venugopal |
2024-03-26 |
$28,354,000 |
| 11908776 |
Semiconductor device with metal die attach to substrate with multi-size cavity |
Nazila Dadvand, Sreenivasan K. Koduri |
2024-02-20 |
$42,955,000 |
| 11869925 |
3D printed semiconductor package |
Daniel Lee Revier |
2024-01-09 |
$22,697,000 |
| 11865773 |
Additive process for circular printing of electronic devices |
Daniel Lee Revier, Sean Chang |
2024-01-09 |
$22,697,000 |
| 11869864 |
Nanowires plated on nanoparticles |
Ralf Jakobskrueger Muenster, Sreenivasan K. Koduri |
2024-01-09 |
$22,697,000 |
| 11854933 |
Thermally conductive wafer layer |
Nazila Dadvand, Archana Venugopal, Daniel Lee Revier |
2023-12-26 |
$25,539,000 |
| 11815526 |
Aging compensation of a ferroelectric piezoelectric shock sensor |
Scott R. Summerfelt |
2023-11-14 |
$30,271,000 |
| 11791296 |
Dielectric and metallic nanowire bond layers |
Scott R. Summerfelt, Ralf Jakobskrueger Muenster, Sreenivasan K. Koduri |
2023-10-17 |
$20,967,000 |
| 11774519 |
Shielded sensor structure and method of making same |
Yong Deng, Jo Bito |
2023-10-03 |
$30,278,000 |
| 11728111 |
Liquid metal MEMS switch |
Adam Joseph Fruehling, Dishit Paresh Parekh, Daniel Lee Revier |
2023-08-15 |
$48,295,000 |