Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12172374 | Additive process for circular printing | Daniel Lee Revier, Benjamin Stassen Cook | 2024-12-24 |
| 11865773 | Additive process for circular printing of electronic devices | Daniel Lee Revier, Benjamin Stassen Cook | 2024-01-09 |
| 11487206 | Methods and apparatus for digital material deposition onto semiconductor wafers | Daniel Lee Revier, Benjamin Stassen Cook, Scott R. Summerfelt | 2022-11-01 |
| 9659769 | Tensile dielectric films using UV curing | Bhadri N. Varadarajan, James S. Sims, Guangquan Lu, David Mordo, Kevin J. Ilcisin +2 more | 2017-05-23 |
| 9034768 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Raashina Humayun, Michal Danek, Aaron R. Fellis | 2015-05-19 |
| 8889233 | Method for reducing stress in porous dielectric films | Maxim Kelman, Krishnan Shrinivasan, Feng Wang, Victor Lu, Guangquan Lu | 2014-11-18 |
| 8835317 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Raashina Humayun, Michal Danek, Aaron R. Fellis | 2014-09-16 |
| 8435894 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Raashina Humayun, Michal Danek, Aaron R. Fellis | 2013-05-07 |
| 8207062 | Method for improving adhesion of low resistivity tungsten/tungsten nitride layers | Juwen Gao, Wei Lei, Michal Danek, Erich R. Klawuhn, Ron Powell | 2012-06-26 |
| 8124531 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Raashina Humayun, Michal Danek, Aaron R. Fellis | 2012-02-28 |
| 8119527 | Depositing tungsten into high aspect ratio features | Anand Chadrashekar, Raashina Humayun, Michal Danek, Aaron R. Fellis | 2012-02-21 |