Issued Patents All Time
Showing 1–25 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12331396 | Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition | Ilanit Fisher, Michal Danek, Patrick A. Van Cleemput, Shruti Vivek Thombare | 2025-06-17 |
| 11901227 | Feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Michal Danek, Juwen Gao, Deqi Wang | 2024-02-13 |
| 11827976 | Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition | Ilanit Fisher, Michal Danek, Patrick A. Van Cleemput, Shruti Vivek Thombare | 2023-11-28 |
| 11670516 | Metal-containing passivation for high aspect ratio etch | Karthik S. Colinjivadi, Samantha Tan, Shih-Ked Lee, George Matamis, Yongsik Yu +4 more | 2023-06-06 |
| 11410883 | Tungsten feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Michal Danek, Juwen Gao, Deqi Wang | 2022-08-09 |
| 11348795 | Metal fill process for three-dimensional vertical NAND wordline | Lawrence Schloss, Sanjay Gopinath, Juwen Gao, Michal Danek, Kaihan Ashtiani | 2022-05-31 |
| 11075115 | Tungsten feature fill | Anand Chandrashekar, Esther Jeng, Michal Danek, Juwen Gao, Deqi Wang | 2021-07-27 |
| 10916434 | Feature fill with multi-stage nucleation inhibition | Deqi Wang, Anand Chandrashekar, Michal Danek | 2021-02-09 |
| 10777453 | Low resistivity films containing molybdenum | Shruti Vivek Thombare, Michal Danek, Chiukin Steven Lai, Joshua Collins, Hanna Bamnolker +3 more | 2020-09-15 |
| 10731250 | Depositing ruthenium layers in interconnect metallization | Do-Young Kim, Jeong-Seok Na, Chiukin Steven Lai, Michal Danek | 2020-08-04 |
| 10580695 | Feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Michal Danek, Juwen Gao, Deqi Wang | 2020-03-03 |
| 10580654 | Feature fill with multi-stage nucleation inhibition | Deqi Wang, Anand Chandrashekar, Michal Danek | 2020-03-03 |
| 10546751 | Forming low resistivity fluorine free tungsten film without nucleation | Hanna Bamnolker, Joshua Collins, Tomas Sadilek, Hyeong Seop Shin, Xiaolan Ba +2 more | 2020-01-28 |
| 10529722 | Tungsten for wordline applications | Michal Danek, Hanna Bamnolker, Juwen Gao | 2020-01-07 |
| 10510590 | Low resistivity films containing molybdenum | Shruti Vivek Thombare, Michal Danek, Chiukin Steven Lai, Joshua Collins, Hanna Bamnolker +3 more | 2019-12-17 |
| 10438847 | Manganese barrier and adhesion layers for cobalt | Chiukin Steven Lai, Jeong-Seok Na, Michal Danek, Kaihan Ashtiani | 2019-10-08 |
| 10283404 | Selective deposition of WCN barrier/adhesion layer for interconnect | Jeong-Seok Na, Megha Rathod, Chiukin Steven Lai | 2019-05-07 |
| 10256142 | Tungsten feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Michal Danek, Juwen Gao, Deqi Wang | 2019-04-09 |
| 10242879 | Methods and apparatus for forming smooth and conformal cobalt film by atomic layer deposition | Jeong-Seok Na | 2019-03-26 |
| 10229826 | Systems and methods for forming low resistivity metal contacts and interconnects by reducing and removing metallic oxide | Raihan M. Tarafdar, Shruti Vivek Thombare, Jeong-Seok Na, Chiukin Steven Lai | 2019-03-12 |
| 10170320 | Feature fill with multi-stage nucleation inhibition | Deqi Wang, Anand Chandrashekar, Michal Danek | 2019-01-01 |
| 10103058 | Tungsten feature fill | Anand Chandrashekar, Esther Jeng, Michal Danek, Juwen Gao, Deqi Wang | 2018-10-16 |
| 9997405 | Feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Michal Danek, Juwen Gao, Deqi Wang | 2018-06-12 |
| 9978605 | Method of forming low resistivity fluorine free tungsten film without nucleation | Hanna Bamnolker, Joshua Collins, Tomas Sadilek, Hyeong Seop Shin, Xiaolan Ba +2 more | 2018-05-22 |
| 9953984 | Tungsten for wordline applications | Michal Danek, Hanna Bamnolker, Juwen Gao | 2018-04-24 |