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Shruti Vivek Thombare, Zhongbo YAN, Patrick A. Van Cleemput, Joshua Collins |
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Multi-layer feature fill |
Xiaolan Ba, Ruopeng Deng, Juwen Gao, Sanjay Gopinath |
2024-06-18 |
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Metal fill process for three-dimensional vertical NAND wordline |
Raashina Humayun, Sanjay Gopinath, Juwen Gao, Michal Danek, Kaihan Ashtiani |
2022-05-31 |
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Tungsten films having low fluorine content |
Xiaolan Ba |
2017-09-05 |
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Xiaolan Ba, Raashina Humayun, Michal Danek |
2017-04-04 |
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2016-03-22 |
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Roy Lambertson |
2013-10-22 |
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