Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362188 | Method for preventing line bending during metal fill process | Adam Jandl, Sema Ermez, Lawrence Schloss, Sanjay Gopinath, Michal Danek +2 more | 2025-07-15 |
| 12351914 | Deposition of films using molybdenum precursors | Joshua Collins, Griffin John Kennedy, Patrick A. Van Cleemput, Seshasayee Varadarajan | 2025-07-08 |
| 11970776 | Atomic layer deposition of metal films | Joshua Collins, Griffin John Kennedy, Patrick A. Van Cleemput, Seshasayee Varadarajan | 2024-04-30 |
| 11549175 | Method of depositing tungsten and other metals in 3D NAND structures | Gorun Butail, Joshua Collins, Seshasayee Varadarajan | 2023-01-10 |
| 11355345 | Method for preventing line bending during metal fill process | Adam Jandl, Sema Ermez, Lawrence Schloss, Sanjay Gopinath, Michal Danek +2 more | 2022-06-07 |
| 11225712 | Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack | Joshua Collins, Siew Neo, Kapil Sawlani | 2022-01-18 |
| 10777453 | Low resistivity films containing molybdenum | Shruti Vivek Thombare, Raashina Humayun, Michal Danek, Chiukin Steven Lai, Joshua Collins +3 more | 2020-09-15 |
| 10573522 | Method for preventing line bending during metal fill process | Adam Jandl, Sema Ermez, Lawrence Schloss, Sanjay Gopinath, Michal Danek +2 more | 2020-02-25 |
| 10546751 | Forming low resistivity fluorine free tungsten film without nucleation | Joshua Collins, Tomas Sadilek, Hyeong Seop Shin, Xiaolan Ba, Raashina Humayun +2 more | 2020-01-28 |
| 10529722 | Tungsten for wordline applications | Michal Danek, Raashina Humayun, Juwen Gao | 2020-01-07 |
| 10510590 | Low resistivity films containing molybdenum | Shruti Vivek Thombare, Raashina Humayun, Michal Danek, Chiukin Steven Lai, Joshua Collins +3 more | 2019-12-17 |
| 10214807 | Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack | Joshua Collins, Siew Neo, Kapil Sawlani | 2019-02-26 |
| 9978605 | Method of forming low resistivity fluorine free tungsten film without nucleation | Joshua Collins, Tomas Sadilek, Hyeong Seop Shin, Xiaolan Ba, Raashina Humayun +2 more | 2018-05-22 |
| 9953984 | Tungsten for wordline applications | Michal Danek, Raashina Humayun, Juwen Gao | 2018-04-24 |
| 9595470 | Methods of preparing tungsten and tungsten nitride thin films using tungsten chloride precursor | Raashina Humayun, Juwen Gao, Michal Danek, Joshua Collins | 2017-03-14 |
| 9589808 | Method for depositing extremely low resistivity tungsten | Raashina Humayun, Deqi Wang, Yan Guan | 2017-03-07 |
| 7129178 | Reducing defect formation within an etched semiconductor topography | Benjamin Schwarz, Chan Lon Yan, Daniel Arnzen | 2006-10-31 |
| 6890859 | Methods of forming semiconductor structures having reduced defects, and articles and devices formed thereby | Chan-Lon Yang, Saurabu Dutta Chowdhury, Krishnaswamy Ramkumar | 2005-05-10 |
| 6794269 | Method for and structure formed from fabricating a relatively deep isolation structure | Prabhuram Gopalan, Biju Parameshwaran, Krishnaswamy Ramkumar, Sundar Narayanan | 2004-09-21 |
| 6756315 | Method of forming contact openings | Prashant B. Phatak, Usha Raghuram, Sam Geha | 2004-06-29 |
| 6555484 | Method for controlling the oxidation of implanted silicon | Krishnaswamy Ramkumar | 2003-04-29 |
| 6103379 | Process for the preparation of microspheres and microspheres made thereby | Shlomo Margel | 2000-08-15 |
| 6004399 | Ultra-low particle semiconductor cleaner for removal of particle contamination and residues from surface oxide formation on semiconductor wafers | Kaichiu Wong, Krishnaswamy Ramkumar, Suraj Puri, Rajiv Bhushan, David Wong +2 more | 1999-12-21 |