| 12351914 |
Deposition of films using molybdenum precursors |
Joshua Collins, Griffin John Kennedy, Hanna Bamnolker, Patrick A. Van Cleemput |
2025-07-08 |
|
| 12112980 |
Method to create air gaps |
Patrick A. Van Cleemput, Bart J. van Schravendijk |
2024-10-08 |
$410,372,000 |
| 11970776 |
Atomic layer deposition of metal films |
Joshua Collins, Griffin John Kennedy, Hanna Bamnolker, Patrick A. Van Cleemput |
2024-04-30 |
$255,527,000 |
| 11637037 |
Method to create air gaps |
Patrick A. Van Cleemput, Bart J. van Schravendijk |
2023-04-25 |
$201,276,000 |
| 11549175 |
Method of depositing tungsten and other metals in 3D NAND structures |
Gorun Butail, Joshua Collins, Hanna Bamnolker |
2023-01-10 |
$278,941,000 |
| 11088019 |
Method to create air gaps |
Patrick A. Van Cleemput, Bart J. van Schravendijk |
2021-08-10 |
$172,238,000 |
| 11075127 |
Suppressing interfacial reactions by varying the wafer temperature throughout deposition |
Aaron R. Fellis, Andrew John McKerrow, James S. Sims, Ramesh Chandrasekharan, Jon Henri |
2021-07-27 |
$377,618,000 |
| 10472730 |
Electrolyte concentration control system for high rate electroplating |
Steven T. Mayer, Jonathan D. Reid |
2019-11-12 |
|
| 10378107 |
Low volume showerhead with faceplate holes for improved flow uniformity |
Ramesh Chandrasekharan, Saangrut Sangplung, Shankar Swaminathan, Frank L. Pasquale, Hu Kang +6 more |
2019-08-13 |
$53,965,000 |
| 10347547 |
Suppressing interfacial reactions by varying the wafer temperature throughout deposition |
Aaron R. Fellis, Andrew John McKerrow, James S. Sims, Ramesh Chandrasekharan, Jon Henri |
2019-07-09 |
$66,911,000 |
| 10020188 |
Method for depositing ALD films using halide-based precursors |
James S. Sims, Jon Henri, Ramesh Chandrasekharan, Andrew John McKerrow, Kathryn M. Kelchner |
2018-07-10 |
$47,978,000 |
| 9824884 |
Method for depositing metals free ald silicon nitride films using halide-based precursors |
James S. Sims, Jon Henri, Ramesh Chandrasekharan, Andrew John McKerrow, Kathryn M. Kelchner |
2017-11-21 |
$24,021,000 |
| 9624578 |
Method for RF compensation in plasma assisted atomic layer deposition |
Jun Qian, Frank L. Pasquale, Adrien LaVoie, Chloe Baldasseroni, Hu Kang +7 more |
2017-04-18 |
$24,467,000 |
| 9601693 |
Method for encapsulating a chalcogenide material |
Jon Henri, Dennis M. Hausmann, Bhadri N. Varadarajan |
2017-03-21 |
$23,472,000 |
| 9353444 |
Two-step deposition with improved selectivity |
Artur Kolics, Praveen Nalla |
2016-05-31 |
$11,278,000 |
| 9309604 |
Method and apparatus for electroplating |
Steven T. Mayer, Jingbin Feng, Zhian He, Jonathan D. Reid |
2016-04-12 |
|
| 9109295 |
Electrolyte concentration control system for high rate electroplating |
Jonathan D. Reid, Steven T. Mayer |
2015-08-18 |
|
| 9045841 |
Control of electrolyte composition in a copper electroplating apparatus |
Bryan L. Buckalew, Jonathan D. Reid, John Sukamto, Zhian He, Steven T. Mayer |
2015-06-02 |
|
| 9029258 |
Through silicon via metallization |
Praveen Nalla, Novy Tjokro, Artur Kolics |
2015-05-12 |
$13,244,000 |
| 8475636 |
Method and apparatus for electroplating |
Steven T. Mayer, Jingbin Feng, Zhian He, Jonathan D. Reid |
2013-07-02 |
|
| 8475644 |
Method and apparatus for electroplating |
Steven T. Mayer, Jingbin Feng, Zhian He, Jonathan D. Reid |
2013-07-02 |
|
| 8398831 |
Rapidly cleanable electroplating cup seal |
Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Tariq Majid, Kousik Ganesan +2 more |
2013-03-19 |
|
| 8377268 |
Electroplating cup assembly |
Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid +2 more |
2013-02-19 |
|
| 8362571 |
High compressive stress carbon liners for MOS devices |
Qingguo Wu, James S. Sims, Mandyam Sriram, Haiying Fu, Pramod Subramonium +2 more |
2013-01-29 |
|
| 8308931 |
Method and apparatus for electroplating |
Jonathan D. Reid, Bryan L. Buckalew, Zhian He, Seyang Park, Bryan Pennington +4 more |
2012-11-13 |
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