Issued Patents All Time
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12351914 | Deposition of films using molybdenum precursors | Joshua Collins, Griffin John Kennedy, Hanna Bamnolker, Patrick A. Van Cleemput | 2025-07-08 |
| 12112980 | Method to create air gaps | Patrick A. Van Cleemput, Bart J. van Schravendijk | 2024-10-08 |
| 11970776 | Atomic layer deposition of metal films | Joshua Collins, Griffin John Kennedy, Hanna Bamnolker, Patrick A. Van Cleemput | 2024-04-30 |
| 11637037 | Method to create air gaps | Patrick A. Van Cleemput, Bart J. van Schravendijk | 2023-04-25 |
| 11549175 | Method of depositing tungsten and other metals in 3D NAND structures | Gorun Butail, Joshua Collins, Hanna Bamnolker | 2023-01-10 |
| 11088019 | Method to create air gaps | Patrick A. Van Cleemput, Bart J. van Schravendijk | 2021-08-10 |
| 11075127 | Suppressing interfacial reactions by varying the wafer temperature throughout deposition | Aaron R. Fellis, Andrew John McKerrow, James S. Sims, Ramesh Chandrasekharan, Jon Henri | 2021-07-27 |
| 10472730 | Electrolyte concentration control system for high rate electroplating | Steven T. Mayer, Jonathan D. Reid | 2019-11-12 |
| 10378107 | Low volume showerhead with faceplate holes for improved flow uniformity | Ramesh Chandrasekharan, Saangrut Sangplung, Shankar Swaminathan, Frank L. Pasquale, Hu Kang +6 more | 2019-08-13 |
| 10347547 | Suppressing interfacial reactions by varying the wafer temperature throughout deposition | Aaron R. Fellis, Andrew John McKerrow, James S. Sims, Ramesh Chandrasekharan, Jon Henri | 2019-07-09 |
| 10020188 | Method for depositing ALD films using halide-based precursors | James S. Sims, Jon Henri, Ramesh Chandrasekharan, Andrew John McKerrow, Kathryn M. Kelchner | 2018-07-10 |
| 9824884 | Method for depositing metals free ald silicon nitride films using halide-based precursors | James S. Sims, Jon Henri, Ramesh Chandrasekharan, Andrew John McKerrow, Kathryn M. Kelchner | 2017-11-21 |
| 9624578 | Method for RF compensation in plasma assisted atomic layer deposition | Jun Qian, Frank L. Pasquale, Adrien LaVoie, Chloe Baldasseroni, Hu Kang +7 more | 2017-04-18 |
| 9601693 | Method for encapsulating a chalcogenide material | Jon Henri, Dennis M. Hausmann, Bhadri N. Varadarajan | 2017-03-21 |
| 9353444 | Two-step deposition with improved selectivity | Artur Kolics, Praveen Nalla | 2016-05-31 |
| 9309604 | Method and apparatus for electroplating | Steven T. Mayer, Jingbin Feng, Zhian He, Jonathan D. Reid | 2016-04-12 |
| 9109295 | Electrolyte concentration control system for high rate electroplating | Jonathan D. Reid, Steven T. Mayer | 2015-08-18 |
| 9045841 | Control of electrolyte composition in a copper electroplating apparatus | Bryan L. Buckalew, Jonathan D. Reid, John Sukamto, Zhian He, Steven T. Mayer | 2015-06-02 |
| 9029258 | Through silicon via metallization | Praveen Nalla, Novy Tjokro, Artur Kolics | 2015-05-12 |
| 8475636 | Method and apparatus for electroplating | Steven T. Mayer, Jingbin Feng, Zhian He, Jonathan D. Reid | 2013-07-02 |
| 8475644 | Method and apparatus for electroplating | Steven T. Mayer, Jingbin Feng, Zhian He, Jonathan D. Reid | 2013-07-02 |
| 8398831 | Rapidly cleanable electroplating cup seal | Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Tariq Majid, Kousik Ganesan +2 more | 2013-03-19 |
| 8377268 | Electroplating cup assembly | Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid +2 more | 2013-02-19 |
| 8362571 | High compressive stress carbon liners for MOS devices | Qingguo Wu, James S. Sims, Mandyam Sriram, Haiying Fu, Pramod Subramonium +2 more | 2013-01-29 |
| 8308931 | Method and apparatus for electroplating | Jonathan D. Reid, Bryan L. Buckalew, Zhian He, Seyang Park, Bryan Pennington +4 more | 2012-11-13 |